Dendritic growth from dielectric constituents: a newly discovered failure mechanism in thick-film circuits

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

Silver and other metals can exhibit dendritic short-circuit growth caused by electrochemical migration in conductor-insulator structures. Detailed analysis in migration-free thick-film systems using migration-free conductors has demonstrated that not only metallic components, but dielectric constituent materials also can take part in the formation of migrated shorts, after a chemical reduction process.

Original languageEnglish
Pages (from-to)207-216
Number of pages10
JournalInternational Journal of Microcircuits and Electronic Packaging
Volume16
Issue number3
Publication statusPublished - Dec 3 1993

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Safety, Risk, Reliability and Quality
  • Electrical and Electronic Engineering

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