Silver and other metals can exhibit dendritic short-circuit growth caused by electrochemical migration in conductor-insulator structures. Detailed analysis in migration-free thick-film systems using migration-free conductors has demonstrated that not only metallic components, but dielectric constituent materials also can take part in the formation of migrated shorts, after a chemical reduction process.
|Number of pages||10|
|Journal||International Journal of Microcircuits and Electronic Packaging|
|Publication status||Published - Dec 3 1993|
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Safety, Risk, Reliability and Quality
- Electrical and Electronic Engineering