DELPHI style compact modeling of stacked die packages

András Poppe, Gábor Farkas, John Parry, Péter Szabó, Márta Rencz, Vladimír Székely

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

Multi-die packages with vertical (stacked) arrangement became popular in many application fields, necessitating appropriate thermal measurement and modeling techniques. In this study we present our attempt to yield boundary condition independent models of stacked die pack-ages that reflect phenomena experienced by measurements. In our approach we propose an extension of the DELPHI model topology (ac-counting for multiple junctions). We also tried to extract most of the input data for model generation directly from thermal transient measurement results by the application of structure functions and by using electronically variable thermal resistances ap-plied as boundary conditions during tests.

Original languageEnglish
Title of host publicationTwenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM Proceedings 2007
Pages248-254
Number of pages7
DOIs
Publication statusPublished - Aug 27 2007
Event23rd Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM - San Jose, CA, United States
Duration: Mar 18 2007Mar 22 2007

Publication series

NameAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
ISSN (Print)1065-2221

Other

Other23rd Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM
CountryUnited States
CitySan Jose, CA
Period3/18/073/22/07

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Keywords

  • DELPHI models
  • Stacked die packages
  • Structure functions
  • Thermal transient testing

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering

Cite this

Poppe, A., Farkas, G., Parry, J., Szabó, P., Rencz, M., & Székely, V. (2007). DELPHI style compact modeling of stacked die packages. In Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM Proceedings 2007 (pp. 248-254). [4160919] (Annual IEEE Semiconductor Thermal Measurement and Management Symposium). https://doi.org/10.1109/STHERM.2007.352431