Corrosion investigations on lead-free solder alloys in MgCl2 and NaCl solutions

Balint Medgyes, Gyorgy Kosa, Patrik Tamasi, Bence Szabo, Balazs Illes, Magda Lakatos-Varsanyi, Daniel Rigler, Laszlo Gal, Miklos Ruszinko, Gabor Harsanyi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This study presents the corrosive properties of five various lead-free solder alloys (including Innolot and SAC305) at room temperature. The measurements were carried out in a 0.38 wt % magnesium chloride solution and in various NaCl solutions: 0.1mM, 1mM, 10mM, 500mM and saturated one. After linear sweep voltammetry (LSV) measurements the solder alloys were also investigated by scanning electron microscope (SEM) and energy-dispersive X-ray spectroscopy (EDX) methods. The LSV results showed that the corrosion resistance of Innolot was significantly lower compared to the other ones, such as SAC305 solder alloy in case of MgCl2. Moreover, according to the EDX results bismuth and antimony were detected in the products of Innolot using MgCl2 solution. In case of NaCl measurements, the results showed that Innolot has higher corrosion resistance in case of low, medium and saturated NaCl concentrations, while this result was changed at 500mM NaCl concentration level.

Original languageEnglish
Title of host publication2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging, SIITME 2017 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages427-431
Number of pages5
ISBN (Electronic)9781538616260
DOIs
Publication statusPublished - Jul 1 2017
Event23rd IEEE International Symposium for Design and Technology in Electronic Packaging, SIITME 2017 - Constanta, Romania
Duration: Oct 26 2017Oct 29 2017

Publication series

Name2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging, SIITME 2017 - Proceedings
Volume2018-January

Other

Other23rd IEEE International Symposium for Design and Technology in Electronic Packaging, SIITME 2017
CountryRomania
CityConstanta
Period10/26/1710/29/17

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Keywords

  • LSV
  • Lead-free solder alloy
  • MgCl2
  • NaCl

ASJC Scopus subject areas

  • Polymers and Plastics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering
  • Ceramics and Composites
  • Electronic, Optical and Magnetic Materials

Cite this

Medgyes, B., Kosa, G., Tamasi, P., Szabo, B., Illes, B., Lakatos-Varsanyi, M., Rigler, D., Gal, L., Ruszinko, M., & Harsanyi, G. (2017). Corrosion investigations on lead-free solder alloys in MgCl2 and NaCl solutions. In 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging, SIITME 2017 - Proceedings (pp. 427-431). (2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging, SIITME 2017 - Proceedings; Vol. 2018-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SIITME.2017.8259940