Corrosion and inhibition of copper in different electrolyte solutions

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Abstract

The inhibition action of p-chlorobenzohydroxamic acid (p-Cl-BHA) and dibenzylsulphoxide (DBSO) on copper corrosion in 0:5M NaCl at pH ≈ 6:5 and 0:1M Na2SO4 at pH ≈ 3, respectively, were studied. The corrosion and inhibition processes were monitored by in-situ atomic force microscopy, and morphological changes on the electrode surface were registered. The p-Cl-BHA greatly enhanced the resistance of copper to pitting corrosion in an aqueous solution containing chloride ions. This effect is attributed to the formation of a continuous protective chemisorbed layer on the corroding metallic surface through which Cu2O will be stabilized. The DBSO, because of its adsorption and conversion to a more stable, less soluble sulphide compound, greatly hindered the copper corrosion in the sulphate-containing solutions.

Original languageEnglish
JournalApplied Physics A: Materials Science and Processing
Volume66
Issue numberSUPPL. 1
DOIs
Publication statusPublished - 1998

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Copper corrosion
Butylated Hydroxyanisole
Electrolytes
Copper
corrosion
electrolytes
Corrosion
copper
Sulfides
Pitting
Sulfates
Chlorides
Atomic force microscopy
Ions
Adsorption
Electrodes
Acids
pitting
sulfides
sulfates

ASJC Scopus subject areas

  • Materials Science(all)
  • Chemistry(all)

Cite this

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title = "Corrosion and inhibition of copper in different electrolyte solutions",
abstract = "The inhibition action of p-chlorobenzohydroxamic acid (p-Cl-BHA) and dibenzylsulphoxide (DBSO) on copper corrosion in 0:5M NaCl at pH ≈ 6:5 and 0:1M Na2SO4 at pH ≈ 3, respectively, were studied. The corrosion and inhibition processes were monitored by in-situ atomic force microscopy, and morphological changes on the electrode surface were registered. The p-Cl-BHA greatly enhanced the resistance of copper to pitting corrosion in an aqueous solution containing chloride ions. This effect is attributed to the formation of a continuous protective chemisorbed layer on the corroding metallic surface through which Cu2O will be stabilized. The DBSO, because of its adsorption and conversion to a more stable, less soluble sulphide compound, greatly hindered the copper corrosion in the sulphate-containing solutions.",
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T1 - Corrosion and inhibition of copper in different electrolyte solutions

AU - Shaban, A.

AU - Kálmán, E.

AU - Telegdi, J.

AU - Pálinkás, G.

AU - Dóra, Gy

PY - 1998

Y1 - 1998

N2 - The inhibition action of p-chlorobenzohydroxamic acid (p-Cl-BHA) and dibenzylsulphoxide (DBSO) on copper corrosion in 0:5M NaCl at pH ≈ 6:5 and 0:1M Na2SO4 at pH ≈ 3, respectively, were studied. The corrosion and inhibition processes were monitored by in-situ atomic force microscopy, and morphological changes on the electrode surface were registered. The p-Cl-BHA greatly enhanced the resistance of copper to pitting corrosion in an aqueous solution containing chloride ions. This effect is attributed to the formation of a continuous protective chemisorbed layer on the corroding metallic surface through which Cu2O will be stabilized. The DBSO, because of its adsorption and conversion to a more stable, less soluble sulphide compound, greatly hindered the copper corrosion in the sulphate-containing solutions.

AB - The inhibition action of p-chlorobenzohydroxamic acid (p-Cl-BHA) and dibenzylsulphoxide (DBSO) on copper corrosion in 0:5M NaCl at pH ≈ 6:5 and 0:1M Na2SO4 at pH ≈ 3, respectively, were studied. The corrosion and inhibition processes were monitored by in-situ atomic force microscopy, and morphological changes on the electrode surface were registered. The p-Cl-BHA greatly enhanced the resistance of copper to pitting corrosion in an aqueous solution containing chloride ions. This effect is attributed to the formation of a continuous protective chemisorbed layer on the corroding metallic surface through which Cu2O will be stabilized. The DBSO, because of its adsorption and conversion to a more stable, less soluble sulphide compound, greatly hindered the copper corrosion in the sulphate-containing solutions.

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