Copper plating on and electrical investigation of a low-permittivity cycloolefin-copolymer

A. Pap, Krisztián Kordás, Heli Jantunen, Esa Haapaniemi, Seppo Leppävuori

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

Adhesive ( > 5 MPa) and conductive (ρ∼2 μΩ cm) copper films with a thickness of ∼200 nm were deposited by chemical means on a recently developed low-k cycloolefin-copolymer (COC). The steps of the metallization procedure (chemical etching, metal seeding and copper plating) were optimized. Raman spectroscopy, SEM and AFM were used in the investigation of surface structures formed in the course of processing. Since this polymer is a good candidate for high-frequency microelectronics applications, electrical measurements up to 3 GHz were performed as well.

Original languageEnglish
Pages (from-to)657-661
Number of pages5
JournalPolymer Testing
Volume22
Issue number6
DOIs
Publication statusPublished - Sep 2003

Fingerprint

Copper plating
Metallizing
Microelectronics
Surface structure
Raman spectroscopy
Copper
Etching
Adhesives
Polymers
Permittivity
Copolymers
Metals
Scanning electron microscopy
Processing

Keywords

  • Copper
  • Electroless plating
  • Low-k polymers
  • Metal deposition
  • Palladium

ASJC Scopus subject areas

  • Organic Chemistry
  • Polymers and Plastics

Cite this

Copper plating on and electrical investigation of a low-permittivity cycloolefin-copolymer. / Pap, A.; Kordás, Krisztián; Jantunen, Heli; Haapaniemi, Esa; Leppävuori, Seppo.

In: Polymer Testing, Vol. 22, No. 6, 09.2003, p. 657-661.

Research output: Contribution to journalArticle

Pap, A. ; Kordás, Krisztián ; Jantunen, Heli ; Haapaniemi, Esa ; Leppävuori, Seppo. / Copper plating on and electrical investigation of a low-permittivity cycloolefin-copolymer. In: Polymer Testing. 2003 ; Vol. 22, No. 6. pp. 657-661.
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