Copper-oxide whisker growth on tin-copper alloy coatings caused by the corrosion of Cu6Sn5 intermetallics

Barbara Horváth, Balázs Illés, Tadashi Shinohara, Gábor Harsányi

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

This paper reports the effect of corrosion caused by high temperature and humidity on pure tin and tin-copper alloy coatings. A new phenomenon was observed; the development of copper-oxide whiskers on tin-copper alloys plated on copper substrates (1-5 % copper content stored at 105 C/100 % relative humidity). The copper-oxide whiskers showed similar growth properties to tin whiskers. We have made a model to understand the development of copper-oxide whiskers. Localized corrosion of the tin coating reaches the Cu 6Sn5 intermetallic layer, and copper oxide accumulates after the corrosion of Cu6Sn5. The dilating SnO x compresses and extrudes out the copper oxide in a whisker form.

Original languageEnglish
Pages (from-to)8052-8059
Number of pages8
JournalJournal of Materials Science
Volume48
Issue number23
DOIs
Publication statusPublished - Dec 1 2013

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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