Contactless thermal characterization of high temperature test chamber

Z. Szücs, Gy Bognár, V. Székely, M. Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper the methodology and the results of a contactless thermal characterization of a high temperature test chamber will be introduced. The test chamber is used for fatigue testing of different MEMS devices where the homogenous temperature distribution within the close proximity from the heating filaments is very important. Our aim was to characterize the evolving temperature distribution inside the test chamber. In order to achieve smaller time constant a new contactless sensor card was developed. The contactless thermal characterization method introduced in this paper enables in situ heat distribution measurement inside the test chamber during operation, with the detection of potentially uneven heat distribution.

Original languageEnglish
Title of host publicationDTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Pages345-349
Number of pages5
DOIs
Publication statusPublished - Dec 1 2008
EventDTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - Nice, France
Duration: Apr 9 2008Apr 11 2008

Publication series

NameDTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Other

OtherDTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
CountryFrance
CityNice
Period4/9/084/11/08

Keywords

  • High temperature test chamber
  • IR sensor
  • Infrared radiation
  • Temperature mapping

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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  • Cite this

    Szücs, Z., Bognár, G., Székely, V., & Rencz, M. (2008). Contactless thermal characterization of high temperature test chamber. In DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (pp. 345-349). [4753015] (DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS). https://doi.org/10.1109/DTIP.2008.4753015