Contactless thermal characterization of high temperature test chamber

Z. Szücs, Gy Bognár, V. Székely, M. Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper the methodology and the results of a contactless thermal characterization of a high temperature test chamber will be introduced. The test chamber is used for fatigue testing of different MEMS devices where the homogenous temperature distribution within the close proximity from the heating filaments is very important. Our aim was to characterize the evolving temperature distribution inside the test chamber. In order to achieve smaller time constant a new contactless sensor card was developed. The contactless thermal characterization method introduced in this paper enables in situ heat distribution measurement inside the test chamber during operation, with the detection of potentially uneven heat distribution.

Original languageEnglish
Title of host publicationDTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Pages345-349
Number of pages5
DOIs
Publication statusPublished - 2008
EventDTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - Nice, France
Duration: Apr 9 2008Apr 11 2008

Other

OtherDTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
CountryFrance
CityNice
Period4/9/084/11/08

Fingerprint

Temperature distribution
Temperature
Fatigue testing
MEMS
Heating
Hot Temperature
Sensors

Keywords

  • High temperature test chamber
  • Infrared radiation
  • IR sensor
  • Temperature mapping

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Szücs, Z., Bognár, G., Székely, V., & Rencz, M. (2008). Contactless thermal characterization of high temperature test chamber. In DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (pp. 345-349). [4753015] https://doi.org/10.1109/DTIP.2008.4753015

Contactless thermal characterization of high temperature test chamber. / Szücs, Z.; Bognár, Gy; Székely, V.; Rencz, M.

DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. 2008. p. 345-349 4753015.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Szücs, Z, Bognár, G, Székely, V & Rencz, M 2008, Contactless thermal characterization of high temperature test chamber. in DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS., 4753015, pp. 345-349, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Nice, France, 4/9/08. https://doi.org/10.1109/DTIP.2008.4753015
Szücs Z, Bognár G, Székely V, Rencz M. Contactless thermal characterization of high temperature test chamber. In DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. 2008. p. 345-349. 4753015 https://doi.org/10.1109/DTIP.2008.4753015
Szücs, Z. ; Bognár, Gy ; Székely, V. ; Rencz, M. / Contactless thermal characterization of high temperature test chamber. DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. 2008. pp. 345-349
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