Contact free potential mapping by vibrating capacitor

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The contact free vibrating capacitor method is a valuable tool for investigating the surface potentials of solid surfaces. The purpose of the present article is to summarize the theory and capabilities of the vibrating capacitor method, especially scanning vibrating capacitor pictures in the electronics. After a brief review some results will be discussed, such as a contact potential map taken from a printed circuit board, a surface potential map from a biased ceramic thick film circuit and some results from silicon solid state devices and solar cells. Potential maps contain a lot of information concerning the surface conditions, included the inhomogeneities of the technology, bias and other additional excitation. These potential maps may help in the development, quality control and defect analysis.

Original languageEnglish
Title of host publicationBEC 2006 - 2006 International Baltic Electronics Conference; Proceedings of the 10th Biennial Baltic Electronics Conference
Pages63-66
Number of pages4
DOIs
Publication statusPublished - Dec 1 2006
EventBEC 2006 - 2006 International Baltic Electronics Conference; 10th Biennial Batic Electronics Conference - Tallinn, Estonia
Duration: Oct 2 2006Oct 4 2006

Publication series

NameBEC 2006 - 2006 International Baltic Electronics Conference; Proceedings of the 10th Biennial Baltic Electronics Conference

Other

OtherBEC 2006 - 2006 International Baltic Electronics Conference; 10th Biennial Batic Electronics Conference
CountryEstonia
CityTallinn
Period10/2/0610/4/06

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Mizsei, J. (2006). Contact free potential mapping by vibrating capacitor. In BEC 2006 - 2006 International Baltic Electronics Conference; Proceedings of the 10th Biennial Baltic Electronics Conference (pp. 63-66). [4100282] (BEC 2006 - 2006 International Baltic Electronics Conference; Proceedings of the 10th Biennial Baltic Electronics Conference). https://doi.org/10.1109/BEC.2006.311061