Consideration of Thermal Effects in Logic Simulation

Gergely Nagy, György Horváth, András Poppe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

This paper presents a method that considers thermal effects in logic simulations. The aim is to develop a tool that is capable of modeling the thermal behavior of a digital circuit and, at the same time, yields results almost at the speed of ordinary logic simulators. The importance of such a simulation is that thermal effects can be the cause of signal integrity problems. The structure and the basic operation of the simulator are discussed as well as the issues that need to be addressed throughout the development. A detailed description of the implementation of the tightly integrated thermal and logic simulation is also given.

Original languageEnglish
Title of host publication14th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2008
Pages229-234
Number of pages6
DOIs
Publication statusPublished - Dec 22 2008
Event14th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2008 - Rome, Italy
Duration: Sep 24 2008Sep 26 2008

Publication series

Name14th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2008

Other

Other14th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2008
CountryItaly
CityRome
Period9/24/089/26/08

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Nagy, G., Horváth, G., & Poppe, A. (2008). Consideration of Thermal Effects in Logic Simulation. In 14th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2008 (pp. 229-234). [4669914] (14th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2008). https://doi.org/10.1109/THERMINIC.2008.4669914