Comparing migratory resistive short formation abilities of conductor systems applied in advanced interconnection systems

Research output: Contribution to journalArticle

55 Citations (Scopus)

Abstract

Various metallization types are applied in advanced high-density interconnection systems, pure metals as well as alloys, showing very different abilities for forming migration short circuit failures. There are two conventionally applied empirical possibilities for getting information or comparison about the migration behaviour of a conductor system, the water drop test, and the accelerated climatic tests, such as thermal humidity bias tests and the highly accelerated stress test. The results are generally uncertain showing large spreading and can only be interpreted with difficulties. A third method has also been developed and is presented in the paper for testing metallization systems based on a powerful technique, this is the very well-known cyclic voltammetry (CV) used in electroanalytical chemistry. The results indicate an effective method for making quick comparison between metallization systems in connection with their migration abilities. Moreover, the CV method enables a better understanding of the electrochemical processes that are the bases of the electrochemical migration.

Original languageEnglish
Pages (from-to)229-237
Number of pages9
JournalMicroelectronics Reliability
Volume41
Issue number2
DOIs
Publication statusPublished - Feb 2001

Fingerprint

Metallizing
conductors
Cyclic voltammetry
drop tests
Short circuit currents
Atmospheric humidity
short circuits
Metals
humidity
Water
Testing
chemistry
metals
water

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

@article{f8f05abf5049453d94f5f7e6940001c3,
title = "Comparing migratory resistive short formation abilities of conductor systems applied in advanced interconnection systems",
abstract = "Various metallization types are applied in advanced high-density interconnection systems, pure metals as well as alloys, showing very different abilities for forming migration short circuit failures. There are two conventionally applied empirical possibilities for getting information or comparison about the migration behaviour of a conductor system, the water drop test, and the accelerated climatic tests, such as thermal humidity bias tests and the highly accelerated stress test. The results are generally uncertain showing large spreading and can only be interpreted with difficulties. A third method has also been developed and is presented in the paper for testing metallization systems based on a powerful technique, this is the very well-known cyclic voltammetry (CV) used in electroanalytical chemistry. The results indicate an effective method for making quick comparison between metallization systems in connection with their migration abilities. Moreover, the CV method enables a better understanding of the electrochemical processes that are the bases of the electrochemical migration.",
author = "G. Hars{\'a}nyi and G. Inzelt",
year = "2001",
month = "2",
doi = "10.1016/S0026-2714(00)00093-7",
language = "English",
volume = "41",
pages = "229--237",
journal = "Microelectronics and Reliability",
issn = "0026-2714",
publisher = "Elsevier Limited",
number = "2",

}

TY - JOUR

T1 - Comparing migratory resistive short formation abilities of conductor systems applied in advanced interconnection systems

AU - Harsányi, G.

AU - Inzelt, G.

PY - 2001/2

Y1 - 2001/2

N2 - Various metallization types are applied in advanced high-density interconnection systems, pure metals as well as alloys, showing very different abilities for forming migration short circuit failures. There are two conventionally applied empirical possibilities for getting information or comparison about the migration behaviour of a conductor system, the water drop test, and the accelerated climatic tests, such as thermal humidity bias tests and the highly accelerated stress test. The results are generally uncertain showing large spreading and can only be interpreted with difficulties. A third method has also been developed and is presented in the paper for testing metallization systems based on a powerful technique, this is the very well-known cyclic voltammetry (CV) used in electroanalytical chemistry. The results indicate an effective method for making quick comparison between metallization systems in connection with their migration abilities. Moreover, the CV method enables a better understanding of the electrochemical processes that are the bases of the electrochemical migration.

AB - Various metallization types are applied in advanced high-density interconnection systems, pure metals as well as alloys, showing very different abilities for forming migration short circuit failures. There are two conventionally applied empirical possibilities for getting information or comparison about the migration behaviour of a conductor system, the water drop test, and the accelerated climatic tests, such as thermal humidity bias tests and the highly accelerated stress test. The results are generally uncertain showing large spreading and can only be interpreted with difficulties. A third method has also been developed and is presented in the paper for testing metallization systems based on a powerful technique, this is the very well-known cyclic voltammetry (CV) used in electroanalytical chemistry. The results indicate an effective method for making quick comparison between metallization systems in connection with their migration abilities. Moreover, the CV method enables a better understanding of the electrochemical processes that are the bases of the electrochemical migration.

UR - http://www.scopus.com/inward/record.url?scp=0343408455&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0343408455&partnerID=8YFLogxK

U2 - 10.1016/S0026-2714(00)00093-7

DO - 10.1016/S0026-2714(00)00093-7

M3 - Article

AN - SCOPUS:0343408455

VL - 41

SP - 229

EP - 237

JO - Microelectronics and Reliability

JF - Microelectronics and Reliability

SN - 0026-2714

IS - 2

ER -