Comparative thermal and thermomechanical properties of hot melt adhesives

J. Karger-Kocsis, Zs Senyei, P. Hedvig

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

Thermal properties of hot melt adhesives as well as their bonds can reasonably be studied by thermogravimetric and thermomechanical methods. In addition to thermogravimetry, determination of thermo-oxidative stability is also suitable for assessing the thermal properties of hot melt adhesives. Effects of their components on the glass transition and melting temperatures (Tg and Tm respectively) and the viscoelastic behaviour of hot melt adhesives can be investigated by recording and evaluating of thermomechanical curves. Thermomechanical creep measurements used in the plastics industry are very useful for determining the thermal stability, that is the shear fail temperatures of adhesive bindings. In addition, these methods can be used for qualitative and quantitative investigations of the major ingredients of adhesive compounds.

Original languageEnglish
Pages (from-to)17-22
Number of pages6
JournalInternational Journal of Adhesion and Adhesives
Volume1
Issue number1
DOIs
Publication statusPublished - 1980

Fingerprint

Hot melt adhesives
Adhesives
Thermodynamic properties
Plastics industry
Melting point
Thermogravimetric analysis
Creep
Thermodynamic stability
Hot Temperature
Temperature

ASJC Scopus subject areas

  • Mechanics of Materials
  • Ceramics and Composites
  • Polymers and Plastics
  • Surfaces, Coatings and Films

Cite this

Comparative thermal and thermomechanical properties of hot melt adhesives. / Karger-Kocsis, J.; Senyei, Zs; Hedvig, P.

In: International Journal of Adhesion and Adhesives, Vol. 1, No. 1, 1980, p. 17-22.

Research output: Contribution to journalArticle

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