Comparative thermal and thermomechanical properties of hot melt adhesives

J. Karger-Kocsis, Zs Senyei, P. Hedvig

Research output: Contribution to journalArticle

3 Citations (Scopus)


Thermal properties of hot melt adhesives as well as their bonds can reasonably be studied by thermogravimetric and thermomechanical methods. In addition to thermogravimetry, determination of thermo-oxidative stability is also suitable for assessing the thermal properties of hot melt adhesives. Effects of their components on the glass transition and melting temperatures (Tg and Tm respectively) and the viscoelastic behaviour of hot melt adhesives can be investigated by recording and evaluating of thermomechanical curves. Thermomechanical creep measurements used in the plastics industry are very useful for determining the thermal stability, that is the shear fail temperatures of adhesive bindings. In addition, these methods can be used for qualitative and quantitative investigations of the major ingredients of adhesive compounds.

Original languageEnglish
Pages (from-to)17-22
Number of pages6
JournalInternational Journal of Adhesion and Adhesives
Issue number1
Publication statusPublished - Jul 1980


ASJC Scopus subject areas

  • Biomaterials
  • Chemical Engineering(all)
  • Polymers and Plastics

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