Compact modeling approach for microchannel cooling aimed at high-level thermal analysis of 3D packaged ICs

Marton Nemeth, Lazar Jani, A. Poppe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

This paper presents a new compact modeling technique to describe the convective heat transfer realized by a flow of coolant in integrated microchannels used for thermal management of IC chips. This model works only in case of laminar flow and straight microchannels. The compact model represents the convective heat transfer with alternating resistors in the flow path. The implementation of this model in a successive node reduction (SUNRED) algorithm based thermal filed solver is also presented. A simulation example for a simplified geometry with one channel situated in the center of a pyramidal stack of silicon dice is presented, though, the final target application is in the thermal simulation engine of a logi-thermal simulation system. The errors have been calculated as the difference of the results of the alternating resistor and modified SUNRED model and the result of a detailed CFD simulation. The error of our new compact model was below 2 % for both modeling techniques.

Original languageEnglish
Title of host publicationSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509014576
DOIs
Publication statusPublished - Jul 15 2016
Event18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016 - Budapest, Hungary
Duration: May 30 2016Jun 2 2016

Other

Other18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016
CountryHungary
CityBudapest
Period5/30/166/2/16

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Keywords

  • chip cooling
  • Compact modeling
  • Microfluidics

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Nemeth, M., Jani, L., & Poppe, A. (2016). Compact modeling approach for microchannel cooling aimed at high-level thermal analysis of 3D packaged ICs. In Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016 [7514865] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/DTIP.2016.7514865