Compact dynamic thermal multiport models of packages for MEMS-package co-simulation

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Co-simulation of MEMS and their packages is indispensable if the thermal behavior of the MEMS device is critical. For the co-simulation we need a reduced order thermal model of the package in the form of either behavioral or network model form. The paper presents a method for the automated generation of dynamic thermal multi-port models of packages, based on simulation results. The method is general, in will be applicable also for the direct generation of package multi-port network models of thermal transient testers.

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
EditorsB. Cortois, J.M. Karam, S.P. Levitan, K.W. Markus
Pages415-423
Number of pages9
Volume4408
DOIs
Publication statusPublished - 2001
EventDesign, Test, Integration, and Packaging of MEMS/MOEMS 2001 - Cannes, France
Duration: Apr 25 2001Apr 27 2001

Other

OtherDesign, Test, Integration, and Packaging of MEMS/MOEMS 2001
CountryFrance
CityCannes
Period4/25/014/27/01

Fingerprint

microelectromechanical systems
MEMS
simulation
test equipment
Hot Temperature

Keywords

  • Evaluation of thermal transients
  • Multiport models
  • Reduced order models
  • Thermal models

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Rencz, M., & Székely, V. (2001). Compact dynamic thermal multiport models of packages for MEMS-package co-simulation. In B. Cortois, J. M. Karam, S. P. Levitan, & K. W. Markus (Eds.), Proceedings of SPIE - The International Society for Optical Engineering (Vol. 4408, pp. 415-423) https://doi.org/10.1117/12.425360

Compact dynamic thermal multiport models of packages for MEMS-package co-simulation. / Rencz, M.; Székely, V.

Proceedings of SPIE - The International Society for Optical Engineering. ed. / B. Cortois; J.M. Karam; S.P. Levitan; K.W. Markus. Vol. 4408 2001. p. 415-423.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Rencz, M & Székely, V 2001, Compact dynamic thermal multiport models of packages for MEMS-package co-simulation. in B Cortois, JM Karam, SP Levitan & KW Markus (eds), Proceedings of SPIE - The International Society for Optical Engineering. vol. 4408, pp. 415-423, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, Cannes, France, 4/25/01. https://doi.org/10.1117/12.425360
Rencz M, Székely V. Compact dynamic thermal multiport models of packages for MEMS-package co-simulation. In Cortois B, Karam JM, Levitan SP, Markus KW, editors, Proceedings of SPIE - The International Society for Optical Engineering. Vol. 4408. 2001. p. 415-423 https://doi.org/10.1117/12.425360
Rencz, M. ; Székely, V. / Compact dynamic thermal multiport models of packages for MEMS-package co-simulation. Proceedings of SPIE - The International Society for Optical Engineering. editor / B. Cortois ; J.M. Karam ; S.P. Levitan ; K.W. Markus. Vol. 4408 2001. pp. 415-423
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