Characterization of heat-sinks of socketable LED modules using thermal transient testing

András Poppe, Erno Kollár, Zoltan Tóth, Janos Simonovics

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

As socketable LED modules are being developed the need for thermal characterization of heat-sinks aimed at cooling such modules has also arisen. The natural approach from manufacturers is to apply the component level LED thermal testing standards to characterize complete LED module and heat-sink systems. In order to obtain the real thermal resistance of such a complete assembly needs the consideration of the radiant power of the LEDs when calculating the thermal resistance of the complete assembly. Also, the contribution of the LED module, the thermal interface between the module and the heat-sink and the thermal resistance of the heat-sink need to be separated. For the latter problem thermal transient measurements followed by structure function analysis is a solution. To eliminate the need for the measurement of radiant flux of the LED module we suggest building a thermal dummy of the module in question which mechanically is compatible with the module but the heat source is a conventional silicon device instead of LEDs. The paper provides details how such a thermal dummy was created and used in characterizing different heat-sinks aimed at a particular LED module family.

Original languageEnglish
Title of host publicationTHERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479954155
DOIs
Publication statusPublished - Dec 2 2014
Event20th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2014 - Greenwich, London, United Kingdom
Duration: Sep 24 2014Sep 26 2014

Publication series

NameTHERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings

Other

Other20th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2014
CountryUnited Kingdom
CityGreenwich, London
Period9/24/149/26/14

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ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Poppe, A., Kollár, E., Tóth, Z., & Simonovics, J. (2014). Characterization of heat-sinks of socketable LED modules using thermal transient testing. In THERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings [6972497] (THERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/THERMINIC.2014.6972497