Challenges of LED thermal standardization embedded tutorial (60 minutes): 11:00 am - 12:00 pm

Clemens J.M. Lasance, Andras Poppe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The tutorial discusses the increasing need for standardisation of thermal characterisation of LEDS and LED-based products. It goes without saying that the LED-business is growing exponentially, in fact, much faster than analysts predicted five years ago. Unfortunately, the progress in thermal characterisation has not kept pace. Manufacturers and end-users alike are crying for fair and useful thermal data, but for different reasons. The situation is becoming a serious problem for leading manufacturers who are focussing on a sustainable business for the future and are willing to publish reliable thermal data. Unfortunately, due to the lack of worldwide accepted standards a manufacturer can publish whatever he wants. It also becomes a problem for the experienced user because the thermal data that are published are often rather useless in practice when accuracy is at stake, and accuracy is needed for an educated guess of expected performance and lifetime.

Original languageEnglish
Title of host publicationInternational Conference and Exhibition on Device Packaging 2009
Pages2370-2452
Number of pages83
Publication statusPublished - Dec 1 2008
EventInternational Conference and Exhibition on Device Packaging 2009 - Scottsdale/Fountain Hills, AZ, United States
Duration: Mar 9 2009Mar 12 2009

Publication series

NameInternational Conference and Exhibition on Device Packaging 2009
Volume4

Other

OtherInternational Conference and Exhibition on Device Packaging 2009
CountryUnited States
CityScottsdale/Fountain Hills, AZ
Period3/9/093/12/09

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Lasance, C. J. M., & Poppe, A. (2008). Challenges of LED thermal standardization embedded tutorial (60 minutes): 11:00 am - 12:00 pm. In International Conference and Exhibition on Device Packaging 2009 (pp. 2370-2452). (International Conference and Exhibition on Device Packaging 2009; Vol. 4).