Challenges in LED thermal characterisation

Clemens J.M. Lasance, Andras Poppe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Citations (Scopus)

Abstract

The paper discusses the increasing need for a moresophisticated thermal characterisation of LEDs (LightEmitting Diodes) and LED-based products. It goes without saying that the LED-business is growing exponentiaIly, in fact, much faster than analysts predicted five years ago. Unfortunately, the progress in thermal characterisation has not kept pace. The situation is becoming a serious problem for leading manufacturers who are focussing on a sustainable business for the future and are wiIling to publish reliable thermal data. Unfortunately, due to the lack of worldwide-accepted standards a manufacturer can publish whatever thermal information he wants. It also becomes a problem for the experienced user because the thermal data that are published are often rather useless in practice when accuracy is at stake, and accuracy is needed for an educated guess of expected performance and lifetime. Remarkably, the situation is not much different from the one the IC-world was facing almost 20 years ago. Provided the manufacturers want to cooperate, it is relatively easy to build upon the experience gained in the IC-business and their standard protocols that are in use worldwide. The authors propose to establish a consortium consisting of manufacturers, system designers, software developers and test people.Note: The paper is an update of a white paper preparedfor the JEDEC JCI5.I standardisation committee, two papers presented at Therminic 2008 and one at Semitherm 20091 234.

Original languageEnglish
Title of host publication2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
DOIs
Publication statusPublished - Jul 21 2009
Event2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009 - Delft, Netherlands
Duration: Apr 26 2009Apr 29 2009

Publication series

Name2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

Other

Other2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
CountryNetherlands
CityDelft
Period4/26/094/29/09

ASJC Scopus subject areas

  • Computational Theory and Mathematics
  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

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    Lasance, C. J. M., & Poppe, A. (2009). Challenges in LED thermal characterisation. In 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009 [4938508] (2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009). https://doi.org/10.1109/ESIME.2009.4938508