CFD modelling of magnetic nanoparticle suspension in microfluidics

Peter Palovics, Marton Nemeth, Marta Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper a CFD model is presented to model the magnetic nanoparticle (MNP) suspension aggregation in a microfluidic device. The nanoparticles are injected to the microfluidic chip, which consists of serially connected microchambers. The device with the nanoparticle suspension is used to investigate enzyme-substrate reactions. The current work presents a dedicated two-phase solver for the nanoparticle suspension filling procedure of the chambers. The model relies on our measurements and a magnetorheological model, and it is created with the open source CFD software OpenFOAM.

Original languageEnglish
Title of host publication2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728132860
DOIs
Publication statusPublished - May 2019
Event2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019 - Paris, France
Duration: May 12 2019May 15 2019

Publication series

Name2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019

Conference

Conference2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019
CountryFrance
CityParis
Period5/12/195/15/19

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Keywords

  • CFD
  • Microfluidics
  • OpenFOAM
  • magnetic nanoparticle (MNP)
  • magnetorheology

ASJC Scopus subject areas

  • Safety, Risk, Reliability and Quality
  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Palovics, P., Nemeth, M., & Rencz, M. (2019). CFD modelling of magnetic nanoparticle suspension in microfluidics. In 2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019 [8752689] (2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/DTIP.2019.8752689