Thermal simulation, measuring, modeling and testing of integrated circuits requires special CAD tools. A key problem of the thermal representation is the modeling of the IC chip and the package system. This paper focuses to the identification algorithm and the related modeling tool which is capable to generate automatically the compact model of thermal subsystems. The model generation is based on the thermal responses obtained either from thermal simulation using e.g. FEM tools or from measurements. Two important use of this method are presented in the paper: the application for the qualification and compact model generation of IC packages and for the package consideration and thermal transfer impedance modeling for electro-thermal simulation.
|Number of pages||7|
|Journal||American Society of Mechanical Engineers, EEP|
|Publication status||Published - Dec 1 1997|
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Mechanical Engineering