Augmented Lifecycle Space for traceability and consistency enhancement

Jozsef Klespitz, Miklos Biro, L. Kovács

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In software development application lifecycle management (ALM) systems are used to support the development process. As these products are tailored for best fitting the applied programs and their actual usage is diverse. Often, this means that products of different vendors are applied, which reduce the reachability between different artefacts and the overall consistency of the system. In this paper we are analyzing the applicability of Augmented Lifecycle Space as a new approach. This approach provides the capability to enhance the traceability and consistency while reducing human effort through automation both in homogeneous and heterogeneous tool environments.

Original languageEnglish
Title of host publication2016 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2016 - Conference Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages3973-3977
Number of pages5
ISBN (Electronic)9781509018970
DOIs
Publication statusPublished - Feb 6 2017
Event2016 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2016 - Budapest, Hungary
Duration: Oct 9 2016Oct 12 2016

Other

Other2016 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2016
CountryHungary
CityBudapest
Period10/9/1610/12/16

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Keywords

  • Application lifecycle management
  • Development process improvement
  • Open services for lifecycle collaboration
  • Tool integration
  • Tool interoperability

ASJC Scopus subject areas

  • Computer Vision and Pattern Recognition
  • Artificial Intelligence
  • Control and Optimization
  • Human-Computer Interaction

Cite this

Klespitz, J., Biro, M., & Kovács, L. (2017). Augmented Lifecycle Space for traceability and consistency enhancement. In 2016 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2016 - Conference Proceedings (pp. 3973-3977). [7844854] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SMC.2016.7844854