Applicability of the Maxwell-Kelvin model in soft tissue parameter estimation

Arpad Takacs, Jozsef K. Tar, Tamas Haidegger, Imre J. Rudas

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

This paper presents a novel technique for soft tissue model parameter estimation using experimental data. The most commonly used linear mass-spring-damper models are discussed and investigated in details, extended with two more complex, yet significantly more effective modeling approaches. The transfer functions of these models are created, and the analytical response curves are fit to the experimental data provided. The curve fitting procedure is followed by model parameter acquisition such as obtaining of stiffness and damping coefficients of the discussed model.

Original languageEnglish
Title of host publicationSISY 2014 - IEEE 12th International Symposium on Intelligent Systems and Informatics, Proceedings
EditorsAniko Szakal
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages115-119
Number of pages5
ISBN (Electronic)9781479959969
DOIs
Publication statusPublished - Oct 14 2014
Event12th IEEE International Symposium on Intelligent Systems and Informatics, SISY 2014 - Subotica, Serbia
Duration: Sep 11 2014Sep 13 2014

Publication series

NameSISY 2014 - IEEE 12th International Symposium on Intelligent Systems and Informatics, Proceedings

Other

Other12th IEEE International Symposium on Intelligent Systems and Informatics, SISY 2014
CountrySerbia
CitySubotica
Period9/11/149/13/14

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Artificial Intelligence

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    Takacs, A., Tar, J. K., Haidegger, T., & Rudas, I. J. (2014). Applicability of the Maxwell-Kelvin model in soft tissue parameter estimation. In A. Szakal (Ed.), SISY 2014 - IEEE 12th International Symposium on Intelligent Systems and Informatics, Proceedings (pp. 115-119). [6923569] (SISY 2014 - IEEE 12th International Symposium on Intelligent Systems and Informatics, Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SISY.2014.6923569