Analyzing MCM-C multilayer defects by using acoustic micro imaging

G. Harsányi, J. E. Semmens, S. R. Martell, L. Percsi, E. Toth

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

MCM-C LTCC structures are generally built from relatively high-glass-content dielectric and conductive materials, causing one of the most important problems of the technology. In recent failure analysis investigations, it has been demonstrated that not only rude blistering effect or pinholes can cause short circuit failures leading to decreased yields, but ionic migration and dendritic growth through the melted glass electrolyte may occur. Short circuit locations remain generally undetected in conventional morphology studies performed with optical and scanning electron microscopy. Thus they can only be analyzed by destructive methods, after polishing or cross-section preparation, when the right position can be found with difficulties. Studying a model system of multilayer thick film, it has been found that acoustic micro imaging seems to be a good candidate for revealing the location of short circuit locations nondestructively. This may be a relevant result for future failure analysis processes.

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
Editors Anon
PublisherSPIE
Pages571-576
Number of pages6
Volume3582
Publication statusPublished - 1998
EventProceedings of the 1998 International Symposium on Microelectronics - San Diego, CA, USA
Duration: Nov 1 1998Nov 4 1998

Other

OtherProceedings of the 1998 International Symposium on Microelectronics
CitySan Diego, CA, USA
Period11/1/9811/4/98

Fingerprint

Multicarrier modulation
Short circuit currents
short circuits
Multilayers
Acoustics
Imaging techniques
Defects
failure analysis
Failure analysis
acoustics
defects
Conductive materials
Glass
Multilayer films
Polishing
Thick films
glass
pinholes
Electrolytes
polishing

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Harsányi, G., Semmens, J. E., Martell, S. R., Percsi, L., & Toth, E. (1998). Analyzing MCM-C multilayer defects by using acoustic micro imaging. In Anon (Ed.), Proceedings of SPIE - The International Society for Optical Engineering (Vol. 3582, pp. 571-576). SPIE.

Analyzing MCM-C multilayer defects by using acoustic micro imaging. / Harsányi, G.; Semmens, J. E.; Martell, S. R.; Percsi, L.; Toth, E.

Proceedings of SPIE - The International Society for Optical Engineering. ed. / Anon. Vol. 3582 SPIE, 1998. p. 571-576.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Harsányi, G, Semmens, JE, Martell, SR, Percsi, L & Toth, E 1998, Analyzing MCM-C multilayer defects by using acoustic micro imaging. in Anon (ed.), Proceedings of SPIE - The International Society for Optical Engineering. vol. 3582, SPIE, pp. 571-576, Proceedings of the 1998 International Symposium on Microelectronics, San Diego, CA, USA, 11/1/98.
Harsányi G, Semmens JE, Martell SR, Percsi L, Toth E. Analyzing MCM-C multilayer defects by using acoustic micro imaging. In Anon, editor, Proceedings of SPIE - The International Society for Optical Engineering. Vol. 3582. SPIE. 1998. p. 571-576
Harsányi, G. ; Semmens, J. E. ; Martell, S. R. ; Percsi, L. ; Toth, E. / Analyzing MCM-C multilayer defects by using acoustic micro imaging. Proceedings of SPIE - The International Society for Optical Engineering. editor / Anon. Vol. 3582 SPIE, 1998. pp. 571-576
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