An efficient thermal simulation tool for ICs, microsystem elements and MCMs: The μS-THERMANAL

A. Csendes, V. Székely, M. Rencz

Research output: Contribution to journalArticle

34 Citations (Scopus)

Abstract

Integrated microsystems raise new problems in thermal simulation. The frequently used structures such as cantilevers and membranes have different heat transfer properties than the simple silicon cubes of conventional integrated circuits (ICs). To take advantage of this, numerous functions are realized on these structures based on the thermal principle. Quick and correct thermal simulation of these structures is needed during the design process. The paper presents the μS-THERMANAL thermal simulation tool which is capable of simulating, beyond the IC chips and three-dimensional multi-chip module packaging structures, the cantilever, the bridge and the membrane structures as well, both in steady-state and in the frequency-domain case. The algorithms of the program, based on the Fourier method, are detailed in the paper and numerous examples illustrate the capabilities of the tool.

Original languageEnglish
Pages (from-to)241-255
Number of pages15
JournalMicroelectronics Journal
Volume29
Issue number4-5
Publication statusPublished - Apr 1998

Fingerprint

thermal simulation
Microsystems
Multicarrier modulation
integrated circuits
Integrated circuits
chips
membrane structures
packaging
Membrane structures
Silicon
modules
heat transfer
membranes
Packaging
silicon
Heat transfer
Membranes
Hot Temperature

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

An efficient thermal simulation tool for ICs, microsystem elements and MCMs : The μS-THERMANAL. / Csendes, A.; Székely, V.; Rencz, M.

In: Microelectronics Journal, Vol. 29, No. 4-5, 04.1998, p. 241-255.

Research output: Contribution to journalArticle

@article{8ba53355f85640f4ba407d8736d79d3c,
title = "An efficient thermal simulation tool for ICs, microsystem elements and MCMs: The μS-THERMANAL",
abstract = "Integrated microsystems raise new problems in thermal simulation. The frequently used structures such as cantilevers and membranes have different heat transfer properties than the simple silicon cubes of conventional integrated circuits (ICs). To take advantage of this, numerous functions are realized on these structures based on the thermal principle. Quick and correct thermal simulation of these structures is needed during the design process. The paper presents the μS-THERMANAL thermal simulation tool which is capable of simulating, beyond the IC chips and three-dimensional multi-chip module packaging structures, the cantilever, the bridge and the membrane structures as well, both in steady-state and in the frequency-domain case. The algorithms of the program, based on the Fourier method, are detailed in the paper and numerous examples illustrate the capabilities of the tool.",
author = "A. Csendes and V. Sz{\'e}kely and M. Rencz",
year = "1998",
month = "4",
language = "English",
volume = "29",
pages = "241--255",
journal = "Microelectronics",
issn = "0026-2692",
publisher = "Elsevier Limited",
number = "4-5",

}

TY - JOUR

T1 - An efficient thermal simulation tool for ICs, microsystem elements and MCMs

T2 - The μS-THERMANAL

AU - Csendes, A.

AU - Székely, V.

AU - Rencz, M.

PY - 1998/4

Y1 - 1998/4

N2 - Integrated microsystems raise new problems in thermal simulation. The frequently used structures such as cantilevers and membranes have different heat transfer properties than the simple silicon cubes of conventional integrated circuits (ICs). To take advantage of this, numerous functions are realized on these structures based on the thermal principle. Quick and correct thermal simulation of these structures is needed during the design process. The paper presents the μS-THERMANAL thermal simulation tool which is capable of simulating, beyond the IC chips and three-dimensional multi-chip module packaging structures, the cantilever, the bridge and the membrane structures as well, both in steady-state and in the frequency-domain case. The algorithms of the program, based on the Fourier method, are detailed in the paper and numerous examples illustrate the capabilities of the tool.

AB - Integrated microsystems raise new problems in thermal simulation. The frequently used structures such as cantilevers and membranes have different heat transfer properties than the simple silicon cubes of conventional integrated circuits (ICs). To take advantage of this, numerous functions are realized on these structures based on the thermal principle. Quick and correct thermal simulation of these structures is needed during the design process. The paper presents the μS-THERMANAL thermal simulation tool which is capable of simulating, beyond the IC chips and three-dimensional multi-chip module packaging structures, the cantilever, the bridge and the membrane structures as well, both in steady-state and in the frequency-domain case. The algorithms of the program, based on the Fourier method, are detailed in the paper and numerous examples illustrate the capabilities of the tool.

UR - http://www.scopus.com/inward/record.url?scp=0032043613&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0032043613&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:0032043613

VL - 29

SP - 241

EP - 255

JO - Microelectronics

JF - Microelectronics

SN - 0026-2692

IS - 4-5

ER -