An approach for an industrial method for the in-situ characterization of thermal interface materials

Andras Vass-Varnai, Zoltan Sarkany, Csaba Barna, Marta Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper an approach for the in-situ testing of cutting-edge thermal interface materials (TIM-s) is presented. The novel method is based on existing measurement standards and allows quick and repeatable thermal conductivity measurements on newly developed nano-composite based thermal greases in an application-like environment. During the development of the measurement system both the effect of the quality of the material and the effect of the surface roughness of the DUT fixture on the actual results were taken into account. It is also explained how this method could be applied for the long term reliability testing of TIM-s before introducing them to the industry.

Original languageEnglish
Title of host publication2010 12th Electronics Packaging Technology Conference, EPTC 2010
Pages279-284
Number of pages6
DOIs
Publication statusPublished - Dec 1 2010
Event12th Electronics Packaging Technology Conference, EPTC 2010 - Singapore, Singapore
Duration: Dec 8 2010Dec 10 2010

Publication series

Name2010 12th Electronics Packaging Technology Conference, EPTC 2010

Other

Other12th Electronics Packaging Technology Conference, EPTC 2010
CountrySingapore
CitySingapore
Period12/8/1012/10/10

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Vass-Varnai, A., Sarkany, Z., Barna, C., & Rencz, M. (2010). An approach for an industrial method for the in-situ characterization of thermal interface materials. In 2010 12th Electronics Packaging Technology Conference, EPTC 2010 (pp. 279-284). [5702648] (2010 12th Electronics Packaging Technology Conference, EPTC 2010). https://doi.org/10.1109/EPTC.2010.5702648