An alternative method for electro-thermal circuit simulation

Research output: Chapter in Book/Report/Conference proceedingConference contribution

12 Citations (Scopus)

Abstract

In recent years great attention has been paid to the thermal issues in electronics design on system, board, package and chip level, including thermal and electro-thermal simulation of integrated circuits and MCM-s, or even integrated microsystems. In this paper we address some algorithmic issues regarding the method of simultaneous iteration. With the node reduction algorithm outlined here, electro-thermal simulation of large problems becomes feasible. Besides this algorithmic innovation, we provide a specification for a modular, platform independent electro-thermal simulator.

Original languageEnglish
Title of host publication1999 Southwest Symposium on Mixed-Signal Design, SSMSD 1999
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages117-122
Number of pages6
ISBN (Electronic)0780355105, 9780780355101
DOIs
Publication statusPublished - Jan 1 1999
Event1999 Southwest Symposium on Mixed-Signal Design, SSMSD 1999 - Tucson, United States
Duration: Apr 11 1999Apr 13 1999

Publication series

Name1999 Southwest Symposium on Mixed-Signal Design, SSMSD 1999

Other

Other1999 Southwest Symposium on Mixed-Signal Design, SSMSD 1999
CountryUnited States
CityTucson
Period4/11/994/13/99

ASJC Scopus subject areas

  • Signal Processing
  • Electrical and Electronic Engineering

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    Rencz, M., Székely, V., Páhi, A., & Poppe, A. (1999). An alternative method for electro-thermal circuit simulation. In 1999 Southwest Symposium on Mixed-Signal Design, SSMSD 1999 (pp. 117-122). [768603] (1999 Southwest Symposium on Mixed-Signal Design, SSMSD 1999). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SSMSD.1999.768603