An algorithm for the inclusion of RC compact models of packages into board level thermal simulation tools

M. Rencz, V. Székely, B. Courtois

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The paper presents an algorithm for the co-simulation of packages, given with the RC compact models, and the printed circuit boards. This enables beyond the correct detailed consideration of the heat transfer in the board the calculation of the exact junction temperatures within the packages. Considering individual heat transfer coefficients for each package, or even to each side of the packages, depending on the compact models, is possible. The main advantage is that the methodology keeps the exreme fastness and user friendliness of the board level solvers.

Original languageEnglish
Title of host publication2002 International Conference on Modeling and Simulation of Microsystems - MSM 2002
EditorsM. Laudon, B. Romanowicz
Pages612-615
Number of pages4
Publication statusPublished - Dec 1 2002
Event2002 International Conference on Modeling and Simulation of Microsystems - MSM 2002 - San Juan, Puerto Rico
Duration: Apr 21 2002Apr 25 2002

Publication series

Name2002 International Conference on Modeling and Simulation of Microsystems - MSM 2002

Other

Other2002 International Conference on Modeling and Simulation of Microsystems - MSM 2002
CountryPuerto Rico
CitySan Juan
Period4/21/024/25/02

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Rencz, M., Székely, V., & Courtois, B. (2002). An algorithm for the inclusion of RC compact models of packages into board level thermal simulation tools. In M. Laudon, & B. Romanowicz (Eds.), 2002 International Conference on Modeling and Simulation of Microsystems - MSM 2002 (pp. 612-615). (2002 International Conference on Modeling and Simulation of Microsystems - MSM 2002).