An algorithm for the direct co-simulation of dynamic compact models of packages with the detailed thermal models of boards

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

The paper presents an algorithm for the co-simulation of packages given with RC compact models and printed circuit boards. This enables on one hand the correct detailed consideration of the heat transfer in the board, on the other hand the calculation of the exact junction temperatures within the packages. Considering individual heat transfer coefficients for each package, or even to each side of the packages is possible. The main advantage is that the methodology keeps the fastness and user friendliness of the board level solvers, while giving information also about the details of the temperatures within or at the surfaces of the packages.

Original languageEnglish
Title of host publicationProceedings of 4th Electronics Packaging Technology Conference, EPTC 2002
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages293-298
Number of pages6
ISBN (Print)0780374355, 9780780374355
DOIs
Publication statusPublished - 2002
Event4th Electronics Packaging Technology Conference, EPTC 2002 - Singapore, Singapore
Duration: Dec 10 2002Dec 12 2002

Other

Other4th Electronics Packaging Technology Conference, EPTC 2002
CountrySingapore
CitySingapore
Period12/10/0212/12/02

Fingerprint

Printed circuit boards
Heat transfer coefficients
Heat transfer
Temperature
Hot Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Rencz, M., Székely, V., Poppe, A., & Courtois, B. (2002). An algorithm for the direct co-simulation of dynamic compact models of packages with the detailed thermal models of boards. In Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002 (pp. 293-298). [1185686] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC.2002.1185686

An algorithm for the direct co-simulation of dynamic compact models of packages with the detailed thermal models of boards. / Rencz, M.; Székely, V.; Poppe, A.; Courtois, B.

Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002. Institute of Electrical and Electronics Engineers Inc., 2002. p. 293-298 1185686.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Rencz, M, Székely, V, Poppe, A & Courtois, B 2002, An algorithm for the direct co-simulation of dynamic compact models of packages with the detailed thermal models of boards. in Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002., 1185686, Institute of Electrical and Electronics Engineers Inc., pp. 293-298, 4th Electronics Packaging Technology Conference, EPTC 2002, Singapore, Singapore, 12/10/02. https://doi.org/10.1109/EPTC.2002.1185686
Rencz M, Székely V, Poppe A, Courtois B. An algorithm for the direct co-simulation of dynamic compact models of packages with the detailed thermal models of boards. In Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002. Institute of Electrical and Electronics Engineers Inc. 2002. p. 293-298. 1185686 https://doi.org/10.1109/EPTC.2002.1185686
Rencz, M. ; Székely, V. ; Poppe, A. ; Courtois, B. / An algorithm for the direct co-simulation of dynamic compact models of packages with the detailed thermal models of boards. Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002. Institute of Electrical and Electronics Engineers Inc., 2002. pp. 293-298
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