Algorithmic and practical questions of electro-thermal circuit simulation

Research output: Contribution to journalConference article


In recent years great attention has been paid to the thermal issues in electronics design on system, board, package and chip level, including thermal and electro-thermal simulation of integrated circuits and MCM-s, or even integrated microsystems. In this paper we address some algorithmic issues regarding the method of simultaneous iteration. With the node reduction algorithm outlined here electro-thermal simulation of large problems becomes feasible. Besides this algorithmic innovation we provide a specification for a modular, platform independent electro-thermal simulator.

Original languageEnglish
Pages (from-to)178-187
Number of pages10
JournalProceedings of SPIE - The International Society for Optical Engineering
Publication statusPublished - Dec 1 1999
EventProceedings of the 1999 Design, Characterization, and Packaging for MEMS and Microelectronics - Royal Pines Resort, Aust
Duration: Oct 27 1999Oct 29 1999


ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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