Algorithmic and practical questions of electro-thermal circuit simulation

Research output: Contribution to journalConference article

Abstract

In recent years great attention has been paid to the thermal issues in electronics design on system, board, package and chip level, including thermal and electro-thermal simulation of integrated circuits and MCM-s, or even integrated microsystems. In this paper we address some algorithmic issues regarding the method of simultaneous iteration. With the node reduction algorithm outlined here electro-thermal simulation of large problems becomes feasible. Besides this algorithmic innovation we provide a specification for a modular, platform independent electro-thermal simulator.

Original languageEnglish
Pages (from-to)178-187
Number of pages10
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3893
Publication statusPublished - Dec 1 1999
EventProceedings of the 1999 Design, Characterization, and Packaging for MEMS and Microelectronics - Royal Pines Resort, Aust
Duration: Oct 27 1999Oct 29 1999

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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