Aging tendencies of power MOSFETs - A reliability testing method combined with thermal performance monitoring

G. Hantos, J. Hegedüs, M. Rencz, A. Poppe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Die attach degradation in power electronic devices is a common failure mode besides bond wire damage. This paper describes the chip and packaging level effects of high cycle count power cycling on novel mid-power automotive MOSFETs. The related investigation is carried out in controlled ambient conditions. The thermal transient measurements during the active temperature cycling reliability test were evaluated along with K-factor calibration to identify different failure modes. The described measurement method gives the opportunity to distinguish between electrical and thermal related structural error modes. The newly developed thermal interface used in the DUTs was found to withstand the 150 °C thermal amplitude well beyond 100,000 cycles without fatal failures. The thermal performance degradation was less than 28.5 % after 70,000 cycles for the complete assembly.

Original languageEnglish
Title of host publicationTHERMINIC 2016 - 22nd International Workshop on Thermal Investigations of ICs and Systems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages220-223
Number of pages4
ISBN (Electronic)9781509054503
DOIs
Publication statusPublished - Nov 18 2016
Event22nd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2016 - Budapest, Hungary
Duration: Sep 21 2016Sep 23 2016

Other

Other22nd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2016
CountryHungary
CityBudapest
Period9/21/169/23/16

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ASJC Scopus subject areas

  • Fluid Flow and Transfer Processes
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Hantos, G., Hegedüs, J., Rencz, M., & Poppe, A. (2016). Aging tendencies of power MOSFETs - A reliability testing method combined with thermal performance monitoring. In THERMINIC 2016 - 22nd International Workshop on Thermal Investigations of ICs and Systems (pp. 220-223). [7749055] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/THERMINIC.2016.7749055