Auger electron spectroscopy (AES) was used to determine the mass transport of nickel near Ni/Cu(111) interfaces. A pseudomorphic ultrathin Ni film (of about 7eq-ML) is first deposited onto Cu(111) at room temperature and after the sample is heated at 406°C. Using a simple 'erfc' type fickian solution to fit the dissolution kinetics, the value of the bulk diffusion coefficient of Ni in copper is calculated. A good agreement is observed between AES, extrapolated tracer or SIMS data at this temperature, showing the validity of the method. Having discussed the limitations of the method, we conclude that AES is a powerful technique to determine the mass transport near Ni/Cu(111) interfaces because nickel is completely soluble in copper.
|Number of pages||6|
|Journal||Defect and Diffusion Forum|
|Publication status||Published - 1998|
- Mass Transport
ASJC Scopus subject areas
- Materials Science(all)
- Condensed Matter Physics