Advancing the thermal stability of 3D ICs using logi-thermal simulation

Gergely Nagy, Péter Horváth, László Pohl, András Poppe

Research output: Contribution to journalArticle

16 Citations (Scopus)

Abstract

3D ICs have emerged in the past few years. While they solve a large number of problems related to scaling, they also create new ones. Removing the heat from the layers far from the cooling facilities is a great challenge still under intensive research. This paper shows how logi-thermal simulation can be used to predict the operation parameters of large digital systems realized in 3D ICs. The method can be effectively used to guide place-and-route algorithms and to find the thermal bottlenecks.

Original languageEnglish
Pages (from-to)1114-1120
Number of pages7
JournalMicroelectronics Journal
Volume46
Issue number12
DOIs
Publication statusPublished - Dec 1 2015

Keywords

  • 3D IC
  • Logi-thermal simulation
  • Stacked-die

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Advancing the thermal stability of 3D ICs using logi-thermal simulation'. Together they form a unique fingerprint.

  • Cite this