Advancing the thermal stability of 3D-IC's using logi-thermal simulation

Gergely Nagy, Péter Horváth, László Pohl, Andras Poppe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

3D-ICs have emerged in the past few years. While they solve a large number of problems related to scaling, they also create new ones. Removing the heat from the layers far from the cooling facilities is a great challenge still under intensive research. This paper shows how logi-thermal simulation can be used to predict the operation parameters of large digital systems realized in 3D-ICs. The method can be effectively used to guide place-and-route algorithms and to find the thermal bottlenecks.

Original languageEnglish
Title of host publicationTHERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479954155
DOIs
Publication statusPublished - Dec 2 2014
Event20th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2014 - Greenwich, London, United Kingdom
Duration: Sep 24 2014Sep 26 2014

Publication series

NameTHERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings

Other

Other20th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2014
CountryUnited Kingdom
CityGreenwich, London
Period9/24/149/26/14

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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    Nagy, G., Horváth, P., Pohl, L., & Poppe, A. (2014). Advancing the thermal stability of 3D-IC's using logi-thermal simulation. In THERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings [6972486] (THERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/THERMINIC.2014.6972486