Advances in the thermal measurement and evaluation technics

V. Székely, M. Rencz, S. Torok, G. Vegh, Z. Benedek, C. Marta, J. Mizsei

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Investigation, research and development of new methods for thermal testing and measurement are continuously in the focus of our activity. The main results of the last year's development activity will be presented in this paper.

Original languageEnglish
Title of host publicationProceedings of the 1998 4th International Workshop on Thermal Investigations of ICs and Microstructures
Editors Anon
PublisherIEEE
Pages5-10
Number of pages6
Publication statusPublished - 1998
EventProceedings of the 1998 4th International Workshop on Thermal Investigations of ICs Microstructures - Cannes, Fr
Duration: Sep 27 1998Sep 29 1998

Other

OtherProceedings of the 1998 4th International Workshop on Thermal Investigations of ICs Microstructures
CityCannes, Fr
Period9/27/989/29/98

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

Székely, V., Rencz, M., Torok, S., Vegh, G., Benedek, Z., Marta, C., & Mizsei, J. (1998). Advances in the thermal measurement and evaluation technics. In Anon (Ed.), Proceedings of the 1998 4th International Workshop on Thermal Investigations of ICs and Microstructures (pp. 5-10). IEEE.

Advances in the thermal measurement and evaluation technics. / Székely, V.; Rencz, M.; Torok, S.; Vegh, G.; Benedek, Z.; Marta, C.; Mizsei, J.

Proceedings of the 1998 4th International Workshop on Thermal Investigations of ICs and Microstructures. ed. / Anon. IEEE, 1998. p. 5-10.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Székely, V, Rencz, M, Torok, S, Vegh, G, Benedek, Z, Marta, C & Mizsei, J 1998, Advances in the thermal measurement and evaluation technics. in Anon (ed.), Proceedings of the 1998 4th International Workshop on Thermal Investigations of ICs and Microstructures. IEEE, pp. 5-10, Proceedings of the 1998 4th International Workshop on Thermal Investigations of ICs Microstructures, Cannes, Fr, 9/27/98.
Székely V, Rencz M, Torok S, Vegh G, Benedek Z, Marta C et al. Advances in the thermal measurement and evaluation technics. In Anon, editor, Proceedings of the 1998 4th International Workshop on Thermal Investigations of ICs and Microstructures. IEEE. 1998. p. 5-10
Székely, V. ; Rencz, M. ; Torok, S. ; Vegh, G. ; Benedek, Z. ; Marta, C. ; Mizsei, J. / Advances in the thermal measurement and evaluation technics. Proceedings of the 1998 4th International Workshop on Thermal Investigations of ICs and Microstructures. editor / Anon. IEEE, 1998. pp. 5-10
@inproceedings{a86c1c80b59c473da8c6ad46c011054b,
title = "Advances in the thermal measurement and evaluation technics",
abstract = "Investigation, research and development of new methods for thermal testing and measurement are continuously in the focus of our activity. The main results of the last year's development activity will be presented in this paper.",
author = "V. Sz{\'e}kely and M. Rencz and S. Torok and G. Vegh and Z. Benedek and C. Marta and J. Mizsei",
year = "1998",
language = "English",
pages = "5--10",
editor = "Anon",
booktitle = "Proceedings of the 1998 4th International Workshop on Thermal Investigations of ICs and Microstructures",
publisher = "IEEE",

}

TY - GEN

T1 - Advances in the thermal measurement and evaluation technics

AU - Székely, V.

AU - Rencz, M.

AU - Torok, S.

AU - Vegh, G.

AU - Benedek, Z.

AU - Marta, C.

AU - Mizsei, J.

PY - 1998

Y1 - 1998

N2 - Investigation, research and development of new methods for thermal testing and measurement are continuously in the focus of our activity. The main results of the last year's development activity will be presented in this paper.

AB - Investigation, research and development of new methods for thermal testing and measurement are continuously in the focus of our activity. The main results of the last year's development activity will be presented in this paper.

UR - http://www.scopus.com/inward/record.url?scp=0032294594&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0032294594&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0032294594

SP - 5

EP - 10

BT - Proceedings of the 1998 4th International Workshop on Thermal Investigations of ICs and Microstructures

A2 - Anon, null

PB - IEEE

ER -