Adaptive co-simulation of functional-thermal behaviour of integrated circuits

Lazar Jani, A. Poppe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Thermal issues become serious bottlenecks for high-end and mobile ICs as well. To analyse the temperature dependent behaviour, functional-thermal co-simulation can be performed. We are developing a framework called LogiTherm which can be used to perform such simulation of digital and mixed signal circuits on different abstraction levels. The framework utilizes the so-called simulator coupling technique to connect the thermal and functional domain. Multiple thermal simulator engines are integrated into our system (e.g. 3D-ICE, HotSpot, SUNRED), but their implementation is not efficient on modern computer architectures, thus the simulation speed can be limited. In this paper, we describe a new thermal model and a simulator engine designed for multicore processors and GPUS to enable more detailed simulation. A new, adaptive co-simulation strategy is also described, which can further reduce the computational overhead of the thermal simulations.

Original languageEnglish
Title of host publicationTHERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-8
Number of pages8
Volume2017-January
ISBN (Electronic)9781538619285
DOIs
Publication statusPublished - Dec 21 2017
Event23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017 - Amsterdam, Netherlands
Duration: Sep 27 2017Sep 29 2017

Other

Other23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017
CountryNetherlands
CityAmsterdam
Period9/27/179/29/17

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ASJC Scopus subject areas

  • Safety, Risk, Reliability and Quality
  • Modelling and Simulation
  • Electrical and Electronic Engineering

Cite this

Jani, L., & Poppe, A. (2017). Adaptive co-simulation of functional-thermal behaviour of integrated circuits. In THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems (Vol. 2017-January, pp. 1-8). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/THERMINIC.2017.8233823