A sophisticated method for static testing of tim

V. Székely, G. Somlay, P. Szabó, E. Kollár, M. Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Measuring the thermal resistance of thermal interface materials is an increasingly difficult task. The values to be measured are becoming smaller and smaller as a result of the huge efforts in material science to develop better thermal interface material in order to cope with the growing challenges of thermal management. In this paper we present the concept and some first results of a new TIM tester. The tester is using steady state measurement principle. With the help of dedicated test dies that are used to measure temperature, heat flux and parallelism at the same time, Rth values in the range of as low as 0.01 K/W can be measured with better than 5 % accuracy.

Original languageEnglish
Title of host publicationProceedings of the ASME InterPack Conference 2009, IPACK2009
Pages579-585
Number of pages7
DOIs
Publication statusPublished - Jun 30 2010
Event2009 ASME InterPack Conference, IPACK2009 - San Francisco, CA, United States
Duration: Jul 19 2009Jul 23 2009

Publication series

NameProceedings of the ASME InterPack Conference 2009, IPACK2009
Volume2

Other

Other2009 ASME InterPack Conference, IPACK2009
CountryUnited States
CitySan Francisco, CA
Period7/19/097/23/09

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'A sophisticated method for static testing of tim'. Together they form a unique fingerprint.

  • Cite this

    Székely, V., Somlay, G., Szabó, P., Kollár, E., & Rencz, M. (2010). A sophisticated method for static testing of tim. In Proceedings of the ASME InterPack Conference 2009, IPACK2009 (pp. 579-585). (Proceedings of the ASME InterPack Conference 2009, IPACK2009; Vol. 2). https://doi.org/10.1115/InterPACK2009-89363