A scalable multi-functional thermal test chip family: Design and evaluation

Zs Benedek, B. Courtois, G. Farkas, E. Kollar, S. Mir, A. Poppe, M. Rencz, V. Székely, K. Torki

Research output: Contribution to journalArticle

13 Citations (Scopus)

Abstract

Nowadays, thermal characterization of IC packages and packaging technologies is becoming a key task in thermal engineering. To support this by measurements, we developed a family of thermal test chips that allow a wide range of possible applications. Our chips are based on the same basic cell that is mainly covered by dissipating resistors and also contains a temperature sensor. These basic cells are organized into arrays of different size. The arrays are designed such that further "super arrays" can also be built for tiling up larger package cavities. The first members of the family, TMC9 and TMC81, have been manufactured. Our measurements show that the goals aimed at the design have been achieved.

Original languageEnglish
Pages (from-to)323-330
Number of pages8
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume123
Issue number4
DOIs
Publication statusPublished - Dec 1 2001

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

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