A quasi-SPICE electro-thermal simulator

Albin Szalai, Zoltán Czirkos, V. Székely

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Integrated circuits exhibit coupled electro-thermal phenomena. The circuit elements dissipate heat, which propagates in the chip, rising the temperature of all circuit elements. Since the operation of the latter is temperature dependent, their dissipation will also change. This change results in the variation of the element voltages and currents, causing further changes in the dissipation, etc. Therefore we are facing a pair of couplings: an electronic → thermal one and a thermal → electronic one, meaning that all integrated circuits constitute essentially a mutually coupled electronic and thermal system. In this paper a detailed discussion of the electrothermal phenomena is presented regarding the practical implementation. The final implementation is a SPICE compatible electro-thermal solver (qSPICE), which implements some of the major industry standard models with extended coupled thermal capabilities. The accuracy of qSPICE is demonstrated on multiple examples.

Original languageEnglish
Title of host publication18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012
Pages190-195
Number of pages6
Publication statusPublished - 2012
Event18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012 - Budapest, Hungary
Duration: Sep 25 2012Sep 27 2012

Other

Other18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012
CountryHungary
CityBudapest
Period9/25/129/27/12

Fingerprint

SPICE
Simulators
Integrated circuits
Networks (circuits)
Hot Temperature
Temperature
Electric potential
Industry

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Szalai, A., Czirkos, Z., & Székely, V. (2012). A quasi-SPICE electro-thermal simulator. In 18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012 (pp. 190-195). [6400595]

A quasi-SPICE electro-thermal simulator. / Szalai, Albin; Czirkos, Zoltán; Székely, V.

18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012. 2012. p. 190-195 6400595.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Szalai, A, Czirkos, Z & Székely, V 2012, A quasi-SPICE electro-thermal simulator. in 18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012., 6400595, pp. 190-195, 18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012, Budapest, Hungary, 9/25/12.
Szalai A, Czirkos Z, Székely V. A quasi-SPICE electro-thermal simulator. In 18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012. 2012. p. 190-195. 6400595
Szalai, Albin ; Czirkos, Zoltán ; Székely, V. / A quasi-SPICE electro-thermal simulator. 18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012. 2012. pp. 190-195
@inproceedings{ff5220e6e5104380ad7c890864f372df,
title = "A quasi-SPICE electro-thermal simulator",
abstract = "Integrated circuits exhibit coupled electro-thermal phenomena. The circuit elements dissipate heat, which propagates in the chip, rising the temperature of all circuit elements. Since the operation of the latter is temperature dependent, their dissipation will also change. This change results in the variation of the element voltages and currents, causing further changes in the dissipation, etc. Therefore we are facing a pair of couplings: an electronic → thermal one and a thermal → electronic one, meaning that all integrated circuits constitute essentially a mutually coupled electronic and thermal system. In this paper a detailed discussion of the electrothermal phenomena is presented regarding the practical implementation. The final implementation is a SPICE compatible electro-thermal solver (qSPICE), which implements some of the major industry standard models with extended coupled thermal capabilities. The accuracy of qSPICE is demonstrated on multiple examples.",
author = "Albin Szalai and Zolt{\'a}n Czirkos and V. Sz{\'e}kely",
year = "2012",
language = "English",
isbn = "9782355000225",
pages = "190--195",
booktitle = "18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012",

}

TY - GEN

T1 - A quasi-SPICE electro-thermal simulator

AU - Szalai, Albin

AU - Czirkos, Zoltán

AU - Székely, V.

PY - 2012

Y1 - 2012

N2 - Integrated circuits exhibit coupled electro-thermal phenomena. The circuit elements dissipate heat, which propagates in the chip, rising the temperature of all circuit elements. Since the operation of the latter is temperature dependent, their dissipation will also change. This change results in the variation of the element voltages and currents, causing further changes in the dissipation, etc. Therefore we are facing a pair of couplings: an electronic → thermal one and a thermal → electronic one, meaning that all integrated circuits constitute essentially a mutually coupled electronic and thermal system. In this paper a detailed discussion of the electrothermal phenomena is presented regarding the practical implementation. The final implementation is a SPICE compatible electro-thermal solver (qSPICE), which implements some of the major industry standard models with extended coupled thermal capabilities. The accuracy of qSPICE is demonstrated on multiple examples.

AB - Integrated circuits exhibit coupled electro-thermal phenomena. The circuit elements dissipate heat, which propagates in the chip, rising the temperature of all circuit elements. Since the operation of the latter is temperature dependent, their dissipation will also change. This change results in the variation of the element voltages and currents, causing further changes in the dissipation, etc. Therefore we are facing a pair of couplings: an electronic → thermal one and a thermal → electronic one, meaning that all integrated circuits constitute essentially a mutually coupled electronic and thermal system. In this paper a detailed discussion of the electrothermal phenomena is presented regarding the practical implementation. The final implementation is a SPICE compatible electro-thermal solver (qSPICE), which implements some of the major industry standard models with extended coupled thermal capabilities. The accuracy of qSPICE is demonstrated on multiple examples.

UR - http://www.scopus.com/inward/record.url?scp=84872831170&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84872831170&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:84872831170

SN - 9782355000225

SP - 190

EP - 195

BT - 18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012

ER -