A procedure to correct the error in the structure function based thermal measuring methods

M. Rencz, A. Poppe, E. Kollár, S. Ress, V. Székely, B. Courtois

Research output: Contribution to journalConference article

18 Citations (Scopus)

Abstract

In this paper a methodology is presented to correct the systematic error of structure function based thermal material parameter measuring methods. This error stems from the fact that it is practically impossible to avoid parallel heat-flow paths in case of forced one-dimensional heat conduction. With the presented method we show how to subtract the effect of the parallel heat-flow paths from the measured structure function. With this correction methodology the systematic error of structure function based thermal material parameter measuring methods can be practically eliminated. Application examples demonstrate the accuracy increase obtained with the use of the method.

Original languageEnglish
Pages (from-to)92-97
Number of pages6
JournalAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
Volume20
Publication statusPublished - May 24 2004
Event20th Annual IEEE Semiconductor Thermal Measurement and Management Symposium - Proceedings 2004 - San Jose, CA., United States
Duration: Mar 9 2004Mar 11 2004

Keywords

  • Interface thermal resistance measurement
  • RC thermal models
  • Structure functions
  • Thermal conductivity measurement
  • Thermal transient measurements

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'A procedure to correct the error in the structure function based thermal measuring methods'. Together they form a unique fingerprint.

  • Cite this