A novel simulation environment enabling multilevel power estimation of digital systems

Gergely Nagy, András Poppe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

This paper presents a novel logi-thermal simulator architecture. A logi-thermal simulator encorporates a logic and a thermal core in strong coupling. It is capable of calculating the self-heating of digital blocks and is able to account for the consequences of temperature change by implementing the delays of the blocks as a function of the temperature. The simulator architecture presented is able to work with logic entities described at different levels of abstraction. This allows to simulate a design at a very early phase when only high-level descriptions are available or to simulate systems that have elements in different design phases. Such a feature enables engineers to perform logi-thermal simulation throughout almost the entire design process which allows for the application of multiple-level optimization. It can also be used to shorten simulation times when only some parts of the design need to be simulated in high detail.

Original languageEnglish
Title of host publication17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011
Pages149-152
Number of pages4
Publication statusPublished - Dec 21 2011
Event17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011 - Paris, France
Duration: Sep 27 2011Sep 29 2011

Publication series

Name17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011

Other

Other17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011
CountryFrance
CityParis
Period9/27/119/29/11

Keywords

  • electro-thermal simulation
  • logi-thermal simulation
  • multilevel simulation

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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  • Cite this

    Nagy, G., & Poppe, A. (2011). A novel simulation environment enabling multilevel power estimation of digital systems. In 17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011 (pp. 149-152). [6081015] (17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011).