A novel approach of logi-thermal simulation methodology and implementation for ASIC designs

András Timár, András Poppe, Márta Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

In this paper a novel methodology for temperature distribution calculation on the surface of standard-cell ICs is presented. As feature size is continously shrinking and power density growing, it is inevitable to take thermal effects into account when designing digital integrated circuits and manufacturing them on an ASIC process. This paper presents a flow based on a standardized toolset, to simulate the temperature distribution on the surface of a digital standard-cell circuit. The flow takes the actual layout of the circuit into account as well as the input stimuli and the power characteristics of the cells. A custom software tool, LogiTherm is also presented that handles communication between logical, analog electrical and thermal simulators.

Original languageEnglish
Title of host publicationProceedings of the 17th International Conference on Mixed Design of Integrated Circuits and Systems, MIXDES 2010
Pages351-356
Number of pages6
Publication statusPublished - Oct 6 2010
Event17th International Conference - Mixed Design of Integrated Circuits and Systems, MIXDES 2010 - Wroclaw, Poland
Duration: Jun 24 2010Jun 26 2010

Publication series

NameProceedings of the 17th International Conference - Mixed Design of Integrated Circuits and Systems, MIXDES 2010

Other

Other17th International Conference - Mixed Design of Integrated Circuits and Systems, MIXDES 2010
CountryPoland
CityWroclaw
Period6/24/106/26/10

    Fingerprint

Keywords

  • Eldo
  • Layout
  • Logi-thermal simulation
  • ModelSim
  • Power density
  • Standard cell design
  • Temperature distribution
  • Temperature map
  • Therman
  • Verilog PLI

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Timár, A., Poppe, A., & Rencz, M. (2010). A novel approach of logi-thermal simulation methodology and implementation for ASIC designs. In Proceedings of the 17th International Conference on Mixed Design of Integrated Circuits and Systems, MIXDES 2010 (pp. 351-356). [5551636] (Proceedings of the 17th International Conference - Mixed Design of Integrated Circuits and Systems, MIXDES 2010).