A new strategy in face milling - inverse cutting technology

Bernhard Karpuschewski, J. Kundrák, Thomas Emmer, Dmytro Borysenko

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

The article describes a new technology in milling of the flat surfaces - Inverse Cutting Technology. The theoretical basics of the inverse cutting are formulated. The boundary conditions of the process depending on the cutting parameters are presented. The chip formation and chip flow by inverse milling are simulated. The comparison of cutting forces by conventional and inverse face milling is shown. Finally, cutting experiments were conducted to confirm the results of the 3D-FEM-simulation.

Original languageEnglish
Title of host publicationPrecision Machining IX - ICPM 2017
PublisherTrans Tech Publications Ltd
Pages331-338
Number of pages8
ISBN (Print)9783035711998
DOIs
Publication statusPublished - Jan 1 2017
Event9th International Congress on Precision Machining, ICPM 2017 - Athens, Greece
Duration: Sep 6 2017Sep 9 2017

Publication series

NameSolid State Phenomena
Volume261 SSP
ISSN (Electronic)1662-9779

Other

Other9th International Congress on Precision Machining, ICPM 2017
CountryGreece
CityAthens
Period9/6/179/9/17

Fingerprint

Milling (machining)
chips
flat surfaces
Boundary conditions
boundary conditions
Finite element method
simulation
Experiments

Keywords

  • Chip thickness
  • Face Milling
  • FEM
  • Force
  • Technology

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Karpuschewski, B., Kundrák, J., Emmer, T., & Borysenko, D. (2017). A new strategy in face milling - inverse cutting technology. In Precision Machining IX - ICPM 2017 (pp. 331-338). (Solid State Phenomena; Vol. 261 SSP). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/SSP.261.331

A new strategy in face milling - inverse cutting technology. / Karpuschewski, Bernhard; Kundrák, J.; Emmer, Thomas; Borysenko, Dmytro.

Precision Machining IX - ICPM 2017. Trans Tech Publications Ltd, 2017. p. 331-338 (Solid State Phenomena; Vol. 261 SSP).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Karpuschewski, B, Kundrák, J, Emmer, T & Borysenko, D 2017, A new strategy in face milling - inverse cutting technology. in Precision Machining IX - ICPM 2017. Solid State Phenomena, vol. 261 SSP, Trans Tech Publications Ltd, pp. 331-338, 9th International Congress on Precision Machining, ICPM 2017, Athens, Greece, 9/6/17. https://doi.org/10.4028/www.scientific.net/SSP.261.331
Karpuschewski B, Kundrák J, Emmer T, Borysenko D. A new strategy in face milling - inverse cutting technology. In Precision Machining IX - ICPM 2017. Trans Tech Publications Ltd. 2017. p. 331-338. (Solid State Phenomena). https://doi.org/10.4028/www.scientific.net/SSP.261.331
Karpuschewski, Bernhard ; Kundrák, J. ; Emmer, Thomas ; Borysenko, Dmytro. / A new strategy in face milling - inverse cutting technology. Precision Machining IX - ICPM 2017. Trans Tech Publications Ltd, 2017. pp. 331-338 (Solid State Phenomena).
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