A multilayer markovian model for change detection in aerial image pairs with large time differences

Praveer Singh, Zoltan Kato, Josiane Zerubia

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Citations (Scopus)

Abstract

In this paper, we propose a Multilayer Markovian model for change detection in registered aerial image pairs with large time differences. A Three Layer Markov Random Field takes into account information from two different sets of features namely the Modified HOG (Histogram of Oriented Gradients) difference and the Gray-Level (GL) Difference. The third layer is the resultant combination of the two layers. Thus we integrate both the texture level as well as the pixel level information to generate the final result. The proposed model uses pair wise interaction retaining the sub-modularity condition for energy. Hence a global energy optimization can be achieved using a standard min-cut/ max flow algorithm ensuring homogeneity in the connected regions.

Original languageEnglish
Title of host publicationProceedings - International Conference on Pattern Recognition
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages924-929
Number of pages6
ISBN (Electronic)9781479952083
DOIs
Publication statusPublished - Dec 4 2014
Event22nd International Conference on Pattern Recognition, ICPR 2014 - Stockholm, Sweden
Duration: Aug 24 2014Aug 28 2014

Publication series

NameProceedings - International Conference on Pattern Recognition
ISSN (Print)1051-4651

Other

Other22nd International Conference on Pattern Recognition, ICPR 2014
CountrySweden
CityStockholm
Period8/24/148/28/14

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ASJC Scopus subject areas

  • Computer Vision and Pattern Recognition

Cite this

Singh, P., Kato, Z., & Zerubia, J. (2014). A multilayer markovian model for change detection in aerial image pairs with large time differences. In Proceedings - International Conference on Pattern Recognition (pp. 924-929). [6976879] (Proceedings - International Conference on Pattern Recognition). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICPR.2014.169