A methodology for the co-simulation of dynamic compact models of packages with the detailed models of boards

Research output: Contribution to journalArticle

16 Citations (Scopus)

Abstract

In this paper, we present a methodology and an algorithm for the co-simulation of packages given with the RC compact models and the printed circuit boards. This enables on one hand the correct detailed consideration of the heat transfer in the board, on the other hand the calculation of the exact junction temperatures within the packages. Considering individual heat transfer coefficients for each package, or even to each side of the packages is possible. The main advantage of the method is that it keeps the fastness and user friendliness of the board level solvers, while giving information also about the details of the temperatures within or at the surfaces of the packages.

Original languageEnglish
Pages (from-to)367-374
Number of pages8
JournalIEEE Transactions on Components and Packaging Technologies
Volume30
Issue number3
DOIs
Publication statusPublished - 2007

Fingerprint

Printed circuit boards
Heat transfer coefficients
Heat transfer
Temperature

Keywords

  • Compact models
  • Package dynamic compact thermal models
  • Package-board co-simulation
  • Thermal simulation

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

@article{8559ee73626e4f989880c6bbd5a71b46,
title = "A methodology for the co-simulation of dynamic compact models of packages with the detailed models of boards",
abstract = "In this paper, we present a methodology and an algorithm for the co-simulation of packages given with the RC compact models and the printed circuit boards. This enables on one hand the correct detailed consideration of the heat transfer in the board, on the other hand the calculation of the exact junction temperatures within the packages. Considering individual heat transfer coefficients for each package, or even to each side of the packages is possible. The main advantage of the method is that it keeps the fastness and user friendliness of the board level solvers, while giving information also about the details of the temperatures within or at the surfaces of the packages.",
keywords = "Compact models, Package dynamic compact thermal models, Package-board co-simulation, Thermal simulation",
author = "M. Rencz and V. Sz{\'e}kely and A. Poppe",
year = "2007",
doi = "10.1109/TCAPT.2007.901740",
language = "English",
volume = "30",
pages = "367--374",
journal = "IEEE Transactions on Components and Packaging Technologies",
issn = "1521-3331",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "3",

}

TY - JOUR

T1 - A methodology for the co-simulation of dynamic compact models of packages with the detailed models of boards

AU - Rencz, M.

AU - Székely, V.

AU - Poppe, A.

PY - 2007

Y1 - 2007

N2 - In this paper, we present a methodology and an algorithm for the co-simulation of packages given with the RC compact models and the printed circuit boards. This enables on one hand the correct detailed consideration of the heat transfer in the board, on the other hand the calculation of the exact junction temperatures within the packages. Considering individual heat transfer coefficients for each package, or even to each side of the packages is possible. The main advantage of the method is that it keeps the fastness and user friendliness of the board level solvers, while giving information also about the details of the temperatures within or at the surfaces of the packages.

AB - In this paper, we present a methodology and an algorithm for the co-simulation of packages given with the RC compact models and the printed circuit boards. This enables on one hand the correct detailed consideration of the heat transfer in the board, on the other hand the calculation of the exact junction temperatures within the packages. Considering individual heat transfer coefficients for each package, or even to each side of the packages is possible. The main advantage of the method is that it keeps the fastness and user friendliness of the board level solvers, while giving information also about the details of the temperatures within or at the surfaces of the packages.

KW - Compact models

KW - Package dynamic compact thermal models

KW - Package-board co-simulation

KW - Thermal simulation

UR - http://www.scopus.com/inward/record.url?scp=65449167198&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=65449167198&partnerID=8YFLogxK

U2 - 10.1109/TCAPT.2007.901740

DO - 10.1109/TCAPT.2007.901740

M3 - Article

AN - SCOPUS:65449167198

VL - 30

SP - 367

EP - 374

JO - IEEE Transactions on Components and Packaging Technologies

JF - IEEE Transactions on Components and Packaging Technologies

SN - 1521-3331

IS - 3

ER -