A method for thermal model generation of MEMS packages

M. Rencz, V. Székely, Zs Kohári, B. Courtois

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

MEMS applications are frequently thermally operated, so knowing the thermal characteristics of their packages is very important. This paper presents a method for the generation of reduced order dynamic thermal models, either from simulated or from measured transient results. The applicability of the method is presented on a benchmark package used for (pressure) sensor applications.

Original languageEnglish
Title of host publication2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000
EditorsM. Laudon, B. Romanowicz
Pages209-212
Number of pages4
Publication statusPublished - 2000
Event2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000 - San Diego, CA, United States
Duration: Mar 27 2000Mar 29 2000

Other

Other2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000
CountryUnited States
CitySan Diego, CA
Period3/27/003/29/00

Fingerprint

MEMS
Pressure sensors
Hot Temperature

Keywords

  • Package models
  • Reduced order models
  • Thermal models

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Rencz, M., Székely, V., Kohári, Z., & Courtois, B. (2000). A method for thermal model generation of MEMS packages. In M. Laudon, & B. Romanowicz (Eds.), 2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000 (pp. 209-212)

A method for thermal model generation of MEMS packages. / Rencz, M.; Székely, V.; Kohári, Zs; Courtois, B.

2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000. ed. / M. Laudon; B. Romanowicz. 2000. p. 209-212.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Rencz, M, Székely, V, Kohári, Z & Courtois, B 2000, A method for thermal model generation of MEMS packages. in M Laudon & B Romanowicz (eds), 2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000. pp. 209-212, 2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000, San Diego, CA, United States, 3/27/00.
Rencz M, Székely V, Kohári Z, Courtois B. A method for thermal model generation of MEMS packages. In Laudon M, Romanowicz B, editors, 2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000. 2000. p. 209-212
Rencz, M. ; Székely, V. ; Kohári, Zs ; Courtois, B. / A method for thermal model generation of MEMS packages. 2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000. editor / M. Laudon ; B. Romanowicz. 2000. pp. 209-212
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