A method for thermal model generation of MEMS packages

M. Rencz, V. Székely, Zs Kohári, B. Courtois

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

MEMS applications are frequently thermally operated, so knowing the thermal characteristics of their packages is very important. This paper presents a method for the generation of reduced order dynamic thermal models, either from simulated or from measured transient results. The applicability of the method is presented on a benchmark package used for (pressure) sensor applications.

Original languageEnglish
Title of host publication2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000
EditorsM. Laudon, B. Romanowicz
Pages209-212
Number of pages4
Publication statusPublished - Dec 1 2000
Event2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000 - San Diego, CA, United States
Duration: Mar 27 2000Mar 29 2000

Publication series

Name2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000

Other

Other2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000
CountryUnited States
CitySan Diego, CA
Period3/27/003/29/00

Keywords

  • Package models
  • Reduced order models
  • Thermal models

ASJC Scopus subject areas

  • Engineering(all)

Fingerprint Dive into the research topics of 'A method for thermal model generation of MEMS packages'. Together they form a unique fingerprint.

  • Cite this

    Rencz, M., Székely, V., Kohári, Z., & Courtois, B. (2000). A method for thermal model generation of MEMS packages. In M. Laudon, & B. Romanowicz (Eds.), 2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000 (pp. 209-212). (2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000).