A method for generating dynamic thermal multiport models of packages

M. Rencz, V. Székely, B. Courtois

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The dynamic thermal behaviour of electronic subsystems is characterised by their dynamic compact models. These models are similar to the steady state models in describing the fact that the heat is usually leaving on different locations (ports), necessitating multi-port description of the thermal behaviour. In our paper we present a method suitable for direct generation of multi-port dynamic compact thermal models from a series of thermal transient simulations or measurements. The generated RC electrical equivalent circuit model provides the same transient functions as the simulated ones for various boundary conditions, proving the accuracy of the method.

Original languageEnglish
Title of host publicationAdvances in Electronic Packaging; Thermal Manegement Reliability
Pages691-699
Number of pages9
Publication statusPublished - Dec 1 2001
EventPacific Rim/International , Intersociety Electronic Packaging Technical/Business Conference and Exhibition - Kauai, Hi, United States
Duration: Jul 8 2001Jul 13 2001

Publication series

NameAdvances in Electronic Packaging
Volume2

Other

OtherPacific Rim/International , Intersociety Electronic Packaging Technical/Business Conference and Exhibition
CountryUnited States
CityKauai, Hi
Period7/8/017/13/01

    Fingerprint

ASJC Scopus subject areas

  • Engineering(all)
  • Electrical and Electronic Engineering

Cite this

Rencz, M., Székely, V., & Courtois, B. (2001). A method for generating dynamic thermal multiport models of packages. In Advances in Electronic Packaging; Thermal Manegement Reliability (pp. 691-699). (Advances in Electronic Packaging; Vol. 2).