A 3-D chip architecture for optical sensing and concurrent processing

Ángel Rodríguez-Vázquez, Ricardo Carmona, Carlos Domínguez Matas, Manuel Suárez-Cambre, Victor Brea, Francisco Pozas, Gustavo Liñán, Peter Foldessy, Akos Zarandy, Csaba Rekeczky

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

This paper presents an architecture for the implementation of vision chips in 3-D integration technologies. This architecture employs the multi-functional pixel concept to achieve full parallel processing of the information and hence high processing speed. The top layer includes an array of optical sensors which are parallel-connected to the second layer, consisting of an array of mixed-signal read-out and pre-processing cells. Multiplexing is employed so that each mixedsignal cell handles several optical sensors. The two remaining layer are respectively a memory (used to store different multi-scale images obtained at the mixed-signal layer) and an array of digital processors. A prototype of this architecture has been implemented in a FDSOI CMOS-3D technology with Through-Silicon-Vias of 5μm x 5μm pitch.

Original languageEnglish
Title of host publicationOptical Sensing and Detection
DOIs
Publication statusPublished - Jun 25 2010
EventOptical Sensing and Detection - Brussels, Belgium
Duration: Apr 12 2010Apr 15 2010

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume7726
ISSN (Print)0277-786X

Other

OtherOptical Sensing and Detection
CountryBelgium
CityBrussels
Period4/12/104/15/10

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Keywords

  • 3-D Optical Sensors
  • Navigation Applications
  • Vision Systems

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Rodríguez-Vázquez, Á., Carmona, R., Domínguez Matas, C., Suárez-Cambre, M., Brea, V., Pozas, F., Liñán, G., Foldessy, P., Zarandy, A., & Rekeczky, C. (2010). A 3-D chip architecture for optical sensing and concurrent processing. In Optical Sensing and Detection [772613] (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 7726). https://doi.org/10.1117/12.855027