3D packaging of a microsystem with special thermal constraints

A. Morrissey, J. Alderman, G. Kelly, Z. Kohari, A. Pahi, M. Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

After presenting the challenges and solutions of the 3D packaging of a medical implant MEMS device the paper presents thermal simulations on the structure. Using this simulation problem as a case study various features of the SUNRED and SYSTUS 3D simulators are compared in the paper.

Original languageEnglish
Title of host publicationProceedings of the 1998 4th International Workshop on Thermal Investigations of ICs and Microstructures
Editors Anon
PublisherIEEE
Pages171-174
Number of pages4
Publication statusPublished - 1998
EventProceedings of the 1998 4th International Workshop on Thermal Investigations of ICs Microstructures - Cannes, Fr
Duration: Sep 27 1998Sep 29 1998

Other

OtherProceedings of the 1998 4th International Workshop on Thermal Investigations of ICs Microstructures
CityCannes, Fr
Period9/27/989/29/98

Fingerprint

Microsystems
MEMS
Packaging
Simulators
Hot Temperature

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Morrissey, A., Alderman, J., Kelly, G., Kohari, Z., Pahi, A., & Rencz, M. (1998). 3D packaging of a microsystem with special thermal constraints. In Anon (Ed.), Proceedings of the 1998 4th International Workshop on Thermal Investigations of ICs and Microstructures (pp. 171-174). IEEE.

3D packaging of a microsystem with special thermal constraints. / Morrissey, A.; Alderman, J.; Kelly, G.; Kohari, Z.; Pahi, A.; Rencz, M.

Proceedings of the 1998 4th International Workshop on Thermal Investigations of ICs and Microstructures. ed. / Anon. IEEE, 1998. p. 171-174.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Morrissey, A, Alderman, J, Kelly, G, Kohari, Z, Pahi, A & Rencz, M 1998, 3D packaging of a microsystem with special thermal constraints. in Anon (ed.), Proceedings of the 1998 4th International Workshop on Thermal Investigations of ICs and Microstructures. IEEE, pp. 171-174, Proceedings of the 1998 4th International Workshop on Thermal Investigations of ICs Microstructures, Cannes, Fr, 9/27/98.
Morrissey A, Alderman J, Kelly G, Kohari Z, Pahi A, Rencz M. 3D packaging of a microsystem with special thermal constraints. In Anon, editor, Proceedings of the 1998 4th International Workshop on Thermal Investigations of ICs and Microstructures. IEEE. 1998. p. 171-174
Morrissey, A. ; Alderman, J. ; Kelly, G. ; Kohari, Z. ; Pahi, A. ; Rencz, M. / 3D packaging of a microsystem with special thermal constraints. Proceedings of the 1998 4th International Workshop on Thermal Investigations of ICs and Microstructures. editor / Anon. IEEE, 1998. pp. 171-174
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