After presenting the challenges and solutions of the 3D packaging of a medical implant MEMS device the paper presents thermal simulations on the structure. Using this simulation problem as a case study various features of the SUNRED and SYSTUS 3D simulators are compared in the paper.
|Number of pages||4|
|Publication status||Published - Jan 1 1998|
|Event||Proceedings of the 1998 4th International Workshop on Thermal Investigations of ICs Microstructures - Cannes, Fr|
Duration: Sep 27 1998 → Sep 29 1998
|Other||Proceedings of the 1998 4th International Workshop on Thermal Investigations of ICs Microstructures|
|Period||9/27/98 → 9/29/98|
ASJC Scopus subject areas