3D packaging of a microsystem with special thermal constraints

A. Morrissey, J. Alderman, G. Kelly, Z. Kohari, A. Pahi, M. Rencz

Research output: Contribution to conferencePaper

Abstract

After presenting the challenges and solutions of the 3D packaging of a medical implant MEMS device the paper presents thermal simulations on the structure. Using this simulation problem as a case study various features of the SUNRED and SYSTUS 3D simulators are compared in the paper.

Original languageEnglish
Pages171-174
Number of pages4
Publication statusPublished - Jan 1 1998
EventProceedings of the 1998 4th International Workshop on Thermal Investigations of ICs Microstructures - Cannes, Fr
Duration: Sep 27 1998Sep 29 1998

Other

OtherProceedings of the 1998 4th International Workshop on Thermal Investigations of ICs Microstructures
CityCannes, Fr
Period9/27/989/29/98

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Morrissey, A., Alderman, J., Kelly, G., Kohari, Z., Pahi, A., & Rencz, M. (1998). 3D packaging of a microsystem with special thermal constraints. 171-174. Paper presented at Proceedings of the 1998 4th International Workshop on Thermal Investigations of ICs Microstructures, Cannes, Fr, .