3D force sensors for laparoscopic surgery tool

Janos Rado, C. Dücső, G. Battistig, Gabor Szebenyi, P. Fürjes, Zbigniew Nawrat, Kamil Rohr

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

3D force sensors were developed to further integration in laparoscopic heads of surgery robots. The Si sensors operate with piezoresistive transduction principle by measuring the stress induced signals of the symmetrically arranged four piezoresistors in a deforming membrane. As the chip size has to be reduced to a few mm2, the conventional anisotropic alkaline etching technique was replaced by deep reactive ion etching (DRIE) for membrane formation. Moreover, DRIE enables to form any geometry of the membrane and offers the formation of monolith force transfer rod protruding over the chip surface. This rod increases shear sensitivity of the structure, thereby plays crucial role in tactile sensing. The technology applies SOI (silicon on insulator) wafers of appropriate device layer thickness, which provide highly uniform membranes and reproducibility of the process. According to the medical and functional requirements the sensors must be covered by biocompatible and sterilisable elastic polymers. As the elastomer drastically effect on the performance of the device, the proposed sensor structures were modelled by coupled finite element simulation to determine the appropriate geometric parameters meet the functional requirements. Sensors were covered with spherically shaped PDMS (polydimethylsiloxane) polymer and the effect of the elastic coating was also studied in terms of sensitivity and response time. Finally, the design of the laparoscopic head with the integrated 3D MEMS force sensors is also demonstrated.

Original languageEnglish
Title of host publicationSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509014576
DOIs
Publication statusPublished - Jul 15 2016
Event18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016 - Budapest, Hungary
Duration: May 30 2016Jun 2 2016

Other

Other18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016
CountryHungary
CityBudapest
Period5/30/166/2/16

Fingerprint

Surgery
Sensors
Membranes
Reactive ion etching
Polymers
Silicon on insulator technology
Elastomers
Polydimethylsiloxane
MEMS
Etching
Robots
Coatings
Geometry

Keywords

  • force sensor
  • Minimal invasive surgery (MIS)
  • polymer coating
  • tactile sensor

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Rado, J., Dücső, C., Battistig, G., Szebenyi, G., Fürjes, P., Nawrat, Z., & Rohr, K. (2016). 3D force sensors for laparoscopic surgery tool. In Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016 [7514829] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/DTIP.2016.7514829

3D force sensors for laparoscopic surgery tool. / Rado, Janos; Dücső, C.; Battistig, G.; Szebenyi, Gabor; Fürjes, P.; Nawrat, Zbigniew; Rohr, Kamil.

Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016. Institute of Electrical and Electronics Engineers Inc., 2016. 7514829.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Rado, J, Dücső, C, Battistig, G, Szebenyi, G, Fürjes, P, Nawrat, Z & Rohr, K 2016, 3D force sensors for laparoscopic surgery tool. in Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016., 7514829, Institute of Electrical and Electronics Engineers Inc., 18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016, Budapest, Hungary, 5/30/16. https://doi.org/10.1109/DTIP.2016.7514829
Rado J, Dücső C, Battistig G, Szebenyi G, Fürjes P, Nawrat Z et al. 3D force sensors for laparoscopic surgery tool. In Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016. Institute of Electrical and Electronics Engineers Inc. 2016. 7514829 https://doi.org/10.1109/DTIP.2016.7514829
Rado, Janos ; Dücső, C. ; Battistig, G. ; Szebenyi, Gabor ; Fürjes, P. ; Nawrat, Zbigniew ; Rohr, Kamil. / 3D force sensors for laparoscopic surgery tool. Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016. Institute of Electrical and Electronics Engineers Inc., 2016.
@inproceedings{8dfac578f9314adfa6ef3f5d80ec99d8,
title = "3D force sensors for laparoscopic surgery tool",
abstract = "3D force sensors were developed to further integration in laparoscopic heads of surgery robots. The Si sensors operate with piezoresistive transduction principle by measuring the stress induced signals of the symmetrically arranged four piezoresistors in a deforming membrane. As the chip size has to be reduced to a few mm2, the conventional anisotropic alkaline etching technique was replaced by deep reactive ion etching (DRIE) for membrane formation. Moreover, DRIE enables to form any geometry of the membrane and offers the formation of monolith force transfer rod protruding over the chip surface. This rod increases shear sensitivity of the structure, thereby plays crucial role in tactile sensing. The technology applies SOI (silicon on insulator) wafers of appropriate device layer thickness, which provide highly uniform membranes and reproducibility of the process. According to the medical and functional requirements the sensors must be covered by biocompatible and sterilisable elastic polymers. As the elastomer drastically effect on the performance of the device, the proposed sensor structures were modelled by coupled finite element simulation to determine the appropriate geometric parameters meet the functional requirements. Sensors were covered with spherically shaped PDMS (polydimethylsiloxane) polymer and the effect of the elastic coating was also studied in terms of sensitivity and response time. Finally, the design of the laparoscopic head with the integrated 3D MEMS force sensors is also demonstrated.",
keywords = "force sensor, Minimal invasive surgery (MIS), polymer coating, tactile sensor",
author = "Janos Rado and C. D{\"u}cső and G. Battistig and Gabor Szebenyi and P. F{\"u}rjes and Zbigniew Nawrat and Kamil Rohr",
year = "2016",
month = "7",
day = "15",
doi = "10.1109/DTIP.2016.7514829",
language = "English",
booktitle = "Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016",
publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - GEN

T1 - 3D force sensors for laparoscopic surgery tool

AU - Rado, Janos

AU - Dücső, C.

AU - Battistig, G.

AU - Szebenyi, Gabor

AU - Fürjes, P.

AU - Nawrat, Zbigniew

AU - Rohr, Kamil

PY - 2016/7/15

Y1 - 2016/7/15

N2 - 3D force sensors were developed to further integration in laparoscopic heads of surgery robots. The Si sensors operate with piezoresistive transduction principle by measuring the stress induced signals of the symmetrically arranged four piezoresistors in a deforming membrane. As the chip size has to be reduced to a few mm2, the conventional anisotropic alkaline etching technique was replaced by deep reactive ion etching (DRIE) for membrane formation. Moreover, DRIE enables to form any geometry of the membrane and offers the formation of monolith force transfer rod protruding over the chip surface. This rod increases shear sensitivity of the structure, thereby plays crucial role in tactile sensing. The technology applies SOI (silicon on insulator) wafers of appropriate device layer thickness, which provide highly uniform membranes and reproducibility of the process. According to the medical and functional requirements the sensors must be covered by biocompatible and sterilisable elastic polymers. As the elastomer drastically effect on the performance of the device, the proposed sensor structures were modelled by coupled finite element simulation to determine the appropriate geometric parameters meet the functional requirements. Sensors were covered with spherically shaped PDMS (polydimethylsiloxane) polymer and the effect of the elastic coating was also studied in terms of sensitivity and response time. Finally, the design of the laparoscopic head with the integrated 3D MEMS force sensors is also demonstrated.

AB - 3D force sensors were developed to further integration in laparoscopic heads of surgery robots. The Si sensors operate with piezoresistive transduction principle by measuring the stress induced signals of the symmetrically arranged four piezoresistors in a deforming membrane. As the chip size has to be reduced to a few mm2, the conventional anisotropic alkaline etching technique was replaced by deep reactive ion etching (DRIE) for membrane formation. Moreover, DRIE enables to form any geometry of the membrane and offers the formation of monolith force transfer rod protruding over the chip surface. This rod increases shear sensitivity of the structure, thereby plays crucial role in tactile sensing. The technology applies SOI (silicon on insulator) wafers of appropriate device layer thickness, which provide highly uniform membranes and reproducibility of the process. According to the medical and functional requirements the sensors must be covered by biocompatible and sterilisable elastic polymers. As the elastomer drastically effect on the performance of the device, the proposed sensor structures were modelled by coupled finite element simulation to determine the appropriate geometric parameters meet the functional requirements. Sensors were covered with spherically shaped PDMS (polydimethylsiloxane) polymer and the effect of the elastic coating was also studied in terms of sensitivity and response time. Finally, the design of the laparoscopic head with the integrated 3D MEMS force sensors is also demonstrated.

KW - force sensor

KW - Minimal invasive surgery (MIS)

KW - polymer coating

KW - tactile sensor

UR - http://www.scopus.com/inward/record.url?scp=84980000570&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84980000570&partnerID=8YFLogxK

U2 - 10.1109/DTIP.2016.7514829

DO - 10.1109/DTIP.2016.7514829

M3 - Conference contribution

AN - SCOPUS:84980000570

BT - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016

PB - Institute of Electrical and Electronics Engineers Inc.

ER -